qcom: Add support for TSENS driver
Subsystems (8)
v6 cover qcom: Add support for TSENS driver
Current set of patches apply on 4.6-rc6. Fixes for the nvmem apis are now posted [1] and queued in -next [2]
Patches [1-6] will need to be merged via thermal tree/Eduardo. Patches [7-11] will need to go via qcom-msm tree/Andy.
Changes since v5:
* Minor review fixes from Eduardo
Changes since v4:
* dropped qcom,tsens-slopes binding, used coefficients instead
* dropped qcom,sensor-id binding
* Added support for msm8996 family
* Other minor review fixes from v4
Changes since v3:
* Dropped 'clk: qcom: create virtual child device for TSENS' which is picked up by Stephen
* Updated GCC bindings with optional TSENS properties
Changes since v2:
* Minor review fixes from Stephen/Punit and rebase on 4.3-rc4
Changes since v1:
* Created virtual tsens device from gcc driver for 8960, with DT having a single node for gcc and tsens
* Minor fixes with rebasing on 4.3-rc1
Changes since RFC:
* Added support for 8916 and 8084
* Based off the latest nvmem framework patches [1]
* Minor review fixes for comments mostly from Lina
This is an attempt to have a single TSENS driver for
the different versions of the TSENS IP that exist, on different qcom msm/apq SoCs'
Support is added for msm8916, msm8960, msm8974 and msm8996 families.
A lot of the work is based of original code from Stephen Boyd and Siddartha Mohanadoss. I have also picked some of what Narendran Rajan did in his attempt to upstream the support for 8960 family. I could not keep the original authorship on any of the patches because I ended up moving the code around quite a bit in an effort to have a single driver for the various devices. I would be glad to change the authorship for any of the patches if needed.
[1] https://lkml.org/lkml/2016/4/24/103
[2] git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc.git char-misc-next
Rajendra Nayak (11):
thermal: qcom: tsens: Add a skeletal TSENS drivers
thermal: qcom: tsens-8916: Add support for 8916 family of SoCs
thermal: qcom: tsens-8974: Add support for 8974 family of SoCs
thermal: core: export apis to get slope and offset
thermal: qcom: tsens-8960: Add support for 8960 family of SoCs
thermal: qcom: tsens-8996: Add support for 8996 family of SoCs
arm: dts: msm8974: Add thermal zones, tsens and qfprom nodes
arm: dts: apq8064: Add thermal zones, tsens and qfprom nodes
arm: dts: apq8084: Add thermal zones, tsens and qfprom nodes
arm64: dts: msm8916: Add thermal zones, tsens and qfprom nodes
arm64: dts: msm8996: Add thermal zones, tsens and qfprom nodes
.../devicetree/bindings/clock/qcom,gcc.txt | 18 ++ .../devicetree/bindings/thermal/qcom-tsens.txt | 21 ++ Documentation/thermal/sysfs-api.txt | 12 + arch/arm/boot/dts/qcom-apq8064.dtsi | 103 ++++++++ arch/arm/boot/dts/qcom-apq8084.dtsi | 103 ++++++++ arch/arm/boot/dts/qcom-msm8974.dtsi | 103 ++++++++ arch/arm64/boot/dts/qcom/msm8916.dtsi | 64 +++++ arch/arm64/boot/dts/qcom/msm8996.dtsi | 92 +++++++ drivers/thermal/Kconfig | 5 + drivers/thermal/Makefile | 1 + drivers/thermal/qcom/Kconfig | 11 + drivers/thermal/qcom/Makefile | 2 + drivers/thermal/qcom/tsens-8916.c | 113 ++++++++ drivers/thermal/qcom/tsens-8960.c | 292 +++++++++++++++++++++ drivers/thermal/qcom/tsens-8974.c | 244 +++++++++++++++++ drivers/thermal/qcom/tsens-8996.c | 84 ++++++ drivers/thermal/qcom/tsens-common.c | 141 ++++++++++ drivers/thermal/qcom/tsens.c | 200 ++++++++++++++ drivers/thermal/qcom/tsens.h | 92 +++++++ drivers/thermal/thermal_core.c | 30 +++ include/linux/thermal.h | 8 + 21 files changed, 1739 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/qcom-tsens.txt create mode 100644 drivers/thermal/qcom/Kconfig create mode 100644 drivers/thermal/qcom/Makefile create mode 100644 drivers/thermal/qcom/tsens-8916.c create mode 100644 drivers/thermal/qcom/tsens-8960.c create mode 100644 drivers/thermal/qcom/tsens-8974.c create mode 100644 drivers/thermal/qcom/tsens-8996.c create mode 100644 drivers/thermal/qcom/tsens-common.c create mode 100644 drivers/thermal/qcom/tsens.c create mode 100644 drivers/thermal/qcom/tsens.h
Signature · 2 lines
QUALCOMM INDIA, on behalf of Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum, hosted by The Linux Foundation
PATCH v6 1/11 thermal: qcom: tsens: Add a skeletal TSENS drivers
TSENS is Qualcomms' thermal temperature sensor device. It supports reading temperatures from multiple thermal sensors present on various QCOM SoCs.
Calibration data is generally read from a non-volatile memory (eeprom) device.
Add a skeleton driver with all the necessary abstractions so a variety of qcom device families which support TSENS can add driver extensions.
Also add the required device tree bindings which can be used to describe the TSENS device in DT.
--- .../devicetree/bindings/thermal/qcom-tsens.txt | 21 +++ drivers/thermal/Kconfig | 5 + drivers/thermal/Makefile | 1 + drivers/thermal/qcom/Kconfig | 11 ++ drivers/thermal/qcom/Makefile | 2 + drivers/thermal/qcom/tsens-common.c | 141 +++++++++++++++ drivers/thermal/qcom/tsens.c | 195 +++++++++++++++++++++ drivers/thermal/qcom/tsens.h | 90 ++++++++++ 8 files changed, 466 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/qcom-tsens.txt create mode 100644 drivers/thermal/qcom/Kconfig create mode 100644 drivers/thermal/qcom/Makefile create mode 100644 drivers/thermal/qcom/tsens-common.c create mode 100644 drivers/thermal/qcom/tsens.c create mode 100644 drivers/thermal/qcom/tsens.h
Documentation/devicetree/bindings/thermal/qcom-tsens.txt new file +21 -0
@@ -0,0 +1,21 @@ +* QCOM SoC Temperature Sensor (TSENS) + +Required properties: +- compatible : + - "qcom,msm8916-tsens" : For 8916 Family of SoCs + - "qcom,msm8974-tsens" : For 8974 Family of SoCs + - "qcom,msm8996-tsens" : For 8996 Family of SoCs + +- reg: Address range of the thermal registers +- #thermal-sensor-cells : Should be 1. See ./thermal.txt for a description. +- Refer to Documentation/devicetree/bindings/nvmem/nvmem.txt to know how to specify +nvmem cells + +Example: +tsens: thermal-sensor at 900000 { + compatible = "qcom,msm8916-tsens"; + reg = <0x4a8000 0x2000>; + nvmem-cells = <&tsens_caldata>, <&tsens_calsel>; + nvmem-cell-names = "caldata", "calsel"; + #thermal-sensor-cells = <1>; + };
drivers/thermal/Kconfig +5 -0
@@ -410,4 +410,9 @@ config QCOM_SPMI_TEMP_ALARM real time die temperature if an ADC is present or an estimate of the temperature based upon the over temperature stage value. +menu "Qualcomm thermal drivers" +depends on (ARCH_QCOM && OF) || COMPILE_TEST +source "drivers/thermal/qcom/Kconfig" +endmenu + endif
drivers/thermal/Makefile +1 -0
@@ -46,6 +46,7 @@ obj-$(CONFIG_TI_SOC_THERMAL) += ti-soc-thermal/ obj-$(CONFIG_INT340X_THERMAL) += int340x_thermal/ obj-$(CONFIG_INTEL_PCH_THERMAL) += intel_pch_thermal.o obj-$(CONFIG_ST_THERMAL) += st/ +obj-$(CONFIG_QCOM_TSENS) += qcom/ obj-$(CONFIG_TEGRA_SOCTHERM) += tegra_soctherm.o obj-$(CONFIG_HISI_THERMAL) += hisi_thermal.o obj-$(CONFIG_MTK_THERMAL) += mtk_thermal.o
drivers/thermal/qcom/Kconfig new file +11 -0
@@ -0,0 +1,11 @@ +config QCOM_TSENS + tristate "Qualcomm TSENS Temperature Alarm" + depends on THERMAL + depends on QCOM_QFPROM + depends on ARCH_QCOM || COMPILE_TEST + help + This enables the thermal sysfs driver for the TSENS device. It shows + up in Sysfs as a thermal zone with multiple trip points. Disabling the + thermal zone device via the mode file results in disabling the sensor. + Also able to set threshold temperature for both hot and cold and update + when a threshold is reached.
drivers/thermal/qcom/Makefile new file +2 -0
@@ -0,0 +1,2 @@ +obj-$(CONFIG_QCOM_TSENS) += qcom_tsens.o +qcom_tsens-y += tsens.o tsens-common.o
drivers/thermal/qcom/tsens-common.c new file +141 -0
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drivers/thermal/qcom/tsens.c new file +195 -0
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drivers/thermal/qcom/tsens.h new file +90 -0
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Signature · 2 lines
QUALCOMM INDIA, on behalf of Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum, hosted by The Linux Foundation
PATCH v6 2/11 thermal: qcom: tsens-8916: Add support for 8916 family of SoCs
In reply to Rajendra NayakAdd support to calibrate sensors on 8916 family and also add common functions to read temperature from sensors (This can be reused on other SoCs having similar TSENS device)
The calibration data is read from eeprom using the generic nvmem framework apis.
Based on the original code by Siddartha Mohanadoss and Stephen Boyd.
--- drivers/thermal/qcom/Makefile | 2 +- drivers/thermal/qcom/tsens-8916.c | 113 ++++++++++++++++++++++++++++++++++++++ drivers/thermal/qcom/tsens.c | 1 + drivers/thermal/qcom/tsens.h | 2 + 4 files changed, 117 insertions(+), 1 deletion(-) create mode 100644 drivers/thermal/qcom/tsens-8916.c
drivers/thermal/qcom/Makefile +1 -1
@@ -1,2 +1,2 @@ obj-$(CONFIG_QCOM_TSENS) += qcom_tsens.o -qcom_tsens-y += tsens.o tsens-common.o +qcom_tsens-y += tsens.o tsens-common.o tsens-8916.o
drivers/thermal/qcom/tsens-8916.c new file +113 -0
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drivers/thermal/qcom/tsens.c +1 -0
@@ -65,6 +65,7 @@ static SIMPLE_DEV_PM_OPS(tsens_pm_ops, tsens_suspend, tsens_resume);static const struct of_device_id tsens_table[] = { { .compatible ="qcom,msm8916-tsens" , + .data = &data_8916, }, { .compatible ="qcom,msm8974-tsens" , },
drivers/thermal/qcom/tsens.h +2 -0
@@ -87,4 +87,6 @@ void compute_intercept_slope(struct tsens_device *, u32 *, u32 *, u32);int init_common (struct tsens_device *);int get_temp_common (struct tsens_device *,int ,int *); +extern const struct tsens_data data_8916; +#endif /* __QCOM_TSENS_H__ */
Signature · 2 lines
QUALCOMM INDIA, on behalf of Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum, hosted by The Linux Foundation
PATCH v6 3/11 thermal: qcom: tsens-8974: Add support for 8974 family of SoCs
In reply to Rajendra NayakAdd .calibrate support for 8974 family as part of tsens_ops.
Based on the original code by Siddartha Mohanadoss and Stephen Boyd.
--- drivers/thermal/qcom/Makefile | 2 +- drivers/thermal/qcom/tsens-8974.c | 244 ++++++++++++++++++++++++++++++++++++++ drivers/thermal/qcom/tsens.c | 1 + drivers/thermal/qcom/tsens.h | 2 +- 4 files changed, 247 insertions(+), 2 deletions(-) create mode 100644 drivers/thermal/qcom/tsens-8974.c
drivers/thermal/qcom/Makefile +1 -1
@@ -1,2 +1,2 @@ obj-$(CONFIG_QCOM_TSENS) += qcom_tsens.o -qcom_tsens-y += tsens.o tsens-common.o tsens-8916.o +qcom_tsens-y += tsens.o tsens-common.o tsens-8916.o tsens-8974.o
drivers/thermal/qcom/tsens-8974.c new file +244 -0
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drivers/thermal/qcom/tsens.c +1 -0
@@ -68,6 +68,7 @@ static const struct of_device_id tsens_table[] = { .data = &data_8916, }, { .compatible = "qcom,msm8974-tsens", + .data = &data_8974, }, {} };
drivers/thermal/qcom/tsens.h +1 -1
@@ -87,6 +87,6 @@ void compute_intercept_slope(struct tsens_device *, u32 *, u32 *, u32);int init_common (struct tsens_device *);int get_temp_common (struct tsens_device *,int ,int *); -extern const struct tsens_data data_8916; +extern const struct tsens_data data_8916, data_8974;#endif /* __QCOM_TSENS_H__ */
Signature · 2 lines
QUALCOMM INDIA, on behalf of Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum, hosted by The Linux Foundation
PATCH v6 4/11 thermal: core: export apis to get slope and offset
In reply to Rajendra NayakAdd apis for platform thermal drivers to query for slope and offset attributes, which might be needed for temperature calculations.
--- Documentation/thermal/sysfs-api.txt | 12 ++++++++++++ drivers/thermal/thermal_core.c | 30 ++++++++++++++++++++++++++++++ include/linux/thermal.h | 8 ++++++++ 3 files changed, 50 insertions(+)
Documentation/thermal/sysfs-api.txt +12 -0
@@ -140,6 +140,18 @@ temperature) and throttle appropriate devices. Normally this function will not need to be called and the resource management code will ensure that the resource is freed. +1.1.7 int thermal_zone_get_slope(struct thermal_zone_device *tz) + + This interface is used to read the slope attribute value + for the thermal zone device, which might be useful for platform + drivers for temperature calculations. + +1.1.8 int thermal_zone_get_offset(struct thermal_zone_device *tz) + + This interface is used to read the offset attribute value + for the thermal zone device, which might be useful for platform + drivers for temperature calculations. + 1.2 thermal cooling device interface 1.2.1 struct thermal_cooling_device *thermal_cooling_device_register(char *name, void *devdata, struct thermal_cooling_device_ops *)
drivers/thermal/thermal_core.c +30 -0
@@ -2065,6 +2065,36 @@ exit: }EXPORT_SYMBOL_GPL (thermal_zone_get_zone_by_name); +/** +* thermal_zone_get_slope - return the slope attribute of the thermal zone +* @tz: thermal zone device with the slope attribute +* +* Return: If the thermal zone device has a slope attribute, return it, else +* return 1. +*/ +int thermal_zone_get_slope (struct thermal_zone_device *tz) +{ +if (tz && tz->tzp) +return tz->tzp->slope; +return 1 ; +} +EXPORT_SYMBOL_GPL (thermal_zone_get_slope); + +/** +* thermal_zone_get_offset - return the offset attribute of the thermal zone +* @tz: thermal zone device with the offset attribute +* +* Return: If the thermal zone device has a offset attribute, return it, else +* return 0. +*/ +int thermal_zone_get_offset (struct thermal_zone_device *tz) +{ +if (tz && tz->tzp) +return tz->tzp->offset; +return 0 ; +} +EXPORT_SYMBOL_GPL (thermal_zone_get_offset); +#ifdef CONFIG_NET static const struct genl_multicast_group thermal_event_mcgrps[] = { { .name = THERMAL_GENL_MCAST_GROUP_NAME, },
include/linux/thermal.h +8 -0
@@ -432,6 +432,8 @@ thermal_of_cooling_device_register(struct device_node *np, char *, void *,void thermal_cooling_device_unregister (struct thermal_cooling_device *);struct thermal_zone_device *thermal_zone_get_zone_by_name (const char *name);int thermal_zone_get_temp (struct thermal_zone_device *tz,int *temp); +int thermal_zone_get_slope (struct thermal_zone_device *tz); +int thermal_zone_get_offset (struct thermal_zone_device *tz);int get_tz_trend (struct thermal_zone_device *,int ); struct thermal_instance *get_thermal_instance(struct thermal_zone_device *,
@@ -489,6 +491,12 @@ static inline struct thermal_zone_device *thermal_zone_get_zone_by_name(static inline int thermal_zone_get_temp (struct thermal_zone_device *tz,int *temp) {return -ENODEV ; } +static inline int thermal_zone_get_slope ( +struct thermal_zone_device *tz) +{return -ENODEV ; } +static inline int thermal_zone_get_offset ( +struct thermal_zone_device *tz) +{return -ENODEV ; }static inline int get_tz_trend (struct thermal_zone_device *tz,int trip) {return -ENODEV ; } static inline struct thermal_instance *
Signature · 2 lines
QUALCOMM INDIA, on behalf of Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum, hosted by The Linux Foundation
PATCH v6 5/11 thermal: qcom: tsens-8960: Add support for 8960 family of SoCs
In reply to Rajendra Nayak8960 family of SoCs have the TSENS device as part of GCC, hence the driver probes the virtual child device created by GCC and uses the parent to extract all DT properties and reuses the GCC regmap.
Also GCC/TSENS are part of a domain thats not always ON. Hence add .suspend and .resume hooks to save and restore some of the inited register context.
Also 8960 family have some of the TSENS init sequence thats required to be done by the HLOS driver (some later versions of TSENS do not export these registers to non-secure world, and hence need these initializations to be done by secure bootloaders)
8660 from the same family has just one sensor and hence some register offset/layout differences which need special handling in the driver.
Based on the original code from Siddartha Mohanadoss, Stephen Boyd and Narendran Rajan.
--- drivers/thermal/qcom/Makefile | 2 +- drivers/thermal/qcom/tsens-8960.c | 292 ++++++++++++++++++++++++++++++++++++++ drivers/thermal/qcom/tsens.c | 8 +- drivers/thermal/qcom/tsens.h | 2 +- 4 files changed, 298 insertions(+), 6 deletions(-) create mode 100644 drivers/thermal/qcom/tsens-8960.c
drivers/thermal/qcom/Makefile +1 -1
@@ -1,2 +1,2 @@ obj-$(CONFIG_QCOM_TSENS) += qcom_tsens.o -qcom_tsens-y += tsens.o tsens-common.o tsens-8916.o tsens-8974.o +qcom_tsens-y += tsens.o tsens-common.o tsens-8916.o tsens-8974.o tsens-8960.o
drivers/thermal/qcom/tsens-8960.c new file +292 -0
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drivers/thermal/qcom/tsens.c +4 -4
@@ -122,10 +122,10 @@ static int tsens_probe(struct platform_device *pdev) np = dev->of_node; id =of_match_node (tsens_table, np); -if (!id) -return -EINVAL ; - - data = id->data; +if (id) + data = id->data; +else + data = &data_8960;if (data->num_sensors <=0 ) {dev_err (dev,"invalid number of sensors\n" );
drivers/thermal/qcom/tsens.h +1 -1
@@ -87,6 +87,6 @@ void compute_intercept_slope(struct tsens_device *, u32 *, u32 *, u32);int init_common (struct tsens_device *);int get_temp_common (struct tsens_device *,int ,int *); -extern const struct tsens_data data_8916, data_8974; +extern const struct tsens_data data_8916, data_8974, data_8960;#endif /* __QCOM_TSENS_H__ */
Signature · 2 lines
QUALCOMM INDIA, on behalf of Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum, hosted by The Linux Foundation
PATCH v6 6/11 thermal: qcom: tsens-8996: Add support for 8996 family of SoCs
In reply to Rajendra NayakThe TSENS controller in 8996 family of SoCs is capable of converting the ADC code outputs to real temperature values (in decidegree Celsius). It can also be programmed to provide raw ADC code, but the secure software on 8996 programs it to provide real temperatures and also does the needed calibrations.
We check the valid bit to ensure valid data is read by the AHB master. And the spec recommends the below algorithm to read data 3 consecutive times, which takes care of the worst case delay taken to propagate the updated data to the register.
--- drivers/thermal/qcom/Makefile | 2 +- drivers/thermal/qcom/tsens-8996.c | 84 +++++++++++++++++++++++++++++++++++++++ drivers/thermal/qcom/tsens.c | 3 ++ drivers/thermal/qcom/tsens.h | 2 +- 4 files changed, 89 insertions(+), 2 deletions(-) create mode 100644 drivers/thermal/qcom/tsens-8996.c
drivers/thermal/qcom/Makefile +1 -1
@@ -1,2 +1,2 @@ obj-$(CONFIG_QCOM_TSENS) += qcom_tsens.o -qcom_tsens-y += tsens.o tsens-common.o tsens-8916.o tsens-8974.o tsens-8960.o +qcom_tsens-y += tsens.o tsens-common.o tsens-8916.o tsens-8974.o tsens-8960.o tsens-8996.o
drivers/thermal/qcom/tsens-8996.c new file +84 -0
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drivers/thermal/qcom/tsens.c +3 -0
@@ -69,6 +69,9 @@ static const struct of_device_id tsens_table[] = { }, { .compatible = "qcom,msm8974-tsens", .data = &data_8974, + }, { + .compatible = "qcom,msm8996-tsens", + .data = &data_8996, }, {} };
drivers/thermal/qcom/tsens.h +1 -1
@@ -87,6 +87,6 @@ void compute_intercept_slope(struct tsens_device *, u32 *, u32 *, u32);int init_common (struct tsens_device *);int get_temp_common (struct tsens_device *,int ,int *); -extern const struct tsens_data data_8916, data_8974, data_8960; +extern const struct tsens_data data_8916, data_8974, data_8960, data_8996;#endif /* __QCOM_TSENS_H__ */
Signature · 2 lines
QUALCOMM INDIA, on behalf of Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum, hosted by The Linux Foundation
PATCH v6 7/11 arm: dts: msm8974: Add thermal zones, tsens and qfprom nodes
In reply to Rajendra NayakAdd thermal zones, tsens and qfprom nodes
--- arch/arm/boot/dts/qcom-msm8974.dtsi | 103 ++++++++++++++++++++++++++++++++++++ 1 file changed, 103 insertions(+)
arch/arm/boot/dts/qcom-msm8974.dtsi +103 -0
@@ -126,6 +126,88 @@ }; }; + thermal-zones { + cpu-thermal0 { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens 5>; + + trips { + cpu_alert0: trip at 0 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + }; + cpu_crit0: trip at 1 { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + + cpu-thermal1 { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens 6>; + + trips { + cpu_alert1: trip at 0 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + }; + cpu_crit1: trip at 1 { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + + cpu-thermal2 { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens 7>; + + trips { + cpu_alert2: trip at 0 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + }; + cpu_crit2: trip at 1 { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + + cpu-thermal3 { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens 8>; + + trips { + cpu_alert3: trip at 0 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + }; + cpu_crit3: trip at 1 { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + }; + cpu-pmu { compatible = "qcom,krait-pmu"; interrupts = <1 7 0xf04>;
@@ -249,6 +331,27 @@ reg = <0xf9011000 0x1000>; }; + qfprom: qfprom at fc4bc000 { + #address-cells = <1>; + #size-cells = <1>; + compatible = "qcom,qfprom"; + reg = <0xfc4bc000 0x1000>; + tsens_calib: calib at d0 { + reg = <0xd0 0x18>; + }; + tsens_backup: backup at 440 { + reg = <0x440 0x10>; + }; + }; + + tsens: thermal-sensor at fc4a8000 { + compatible = "qcom,msm8974-tsens"; + reg = <0xfc4a8000 0x2000>; + nvmem-cells = <&tsens_calib>, <&tsens_backup>; + nvmem-cell-names = "calib", "calib_backup"; + #thermal-sensor-cells = <1>; + }; + timer at f9020000 { #address-cells = <1>; #size-cells = <1>;
Signature · 2 lines
QUALCOMM INDIA, on behalf of Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum, hosted by The Linux Foundation
PATCH v6 7/11 arm: dts: msm8974: Add thermal zones, tsens and qfprom nodes
Quoted 19 lines · Rajendra Nayak
Add thermal zones, tsens and qfprom nodes
Cc Andy Gross <[email protected]>Signed-off-by Rajendra Nayak <[email protected]>--- arch/arm/boot/dts/qcom-msm8974.dtsi | 103 ++++++++++++++++++++++++++++++++++++ 1 file changed, 103 insertions(+)arch/arm/boot/dts/qcom-msm8974.dtsi +3
-0@@ -126,6 +126,88 @@ }; }; + thermal-zones { + cpu-thermal0 { + polling-delay-passive = <250>;
arch/arm/boot/dts/qcom-msm8974.dtsi line 141
Quoted 10 lines
arch/arm/boot/dts/qcom-msm8974.dtsi +10
-0+ polling-delay = <1000>; + + thermal-sensors = <&tsens 5>; + + trips { + cpu_alert0: trip at 0 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + };
You have passive trip points, but not cooling devices.
The cooling-maps property is mandatory, as you can see in the documentation (Documentation/devicetree/bindings/thermal/thermal.txt)
Please add it, for all your zones.
Quoted 104 lines
arch/arm/boot/dts/qcom-msm8974.dtsi +90
-0+ cpu_crit0: trip at 1 { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + + cpu-thermal1 { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens 6>; + + trips { + cpu_alert1: trip at 0 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + }; + cpu_crit1: trip at 1 { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + + cpu-thermal2 { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens 7>; + + trips { + cpu_alert2: trip at 0 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + }; + cpu_crit2: trip at 1 { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + + cpu-thermal3 { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens 8>; + + trips { + cpu_alert3: trip at 0 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + }; + cpu_crit3: trip at 1 { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + }; + cpu-pmu { compatible = "qcom,krait-pmu"; interrupts = <1 7 0xf04>;@@ -249,6 +331,27 @@ reg = <0xf9011000 0x1000>; }; + qfprom: qfprom at fc4bc000 { + #address-cells = <1>; + #size-cells = <1>; + compatible = "qcom,qfprom"; + reg = <0xfc4bc000 0x1000>; + tsens_calib: calib at d0 { + reg = <0xd0 0x18>; + }; + tsens_backup: backup at 440 { + reg = <0x440 0x10>; + }; + }; + + tsens: thermal-sensor at fc4a8000 { + compatible = "qcom,msm8974-tsens"; + reg = <0xfc4a8000 0x2000>; + nvmem-cells = <&tsens_calib>, <&tsens_backup>; + nvmem-cell-names = "calib", "calib_backup"; + #thermal-sensor-cells = <1>; + }; + timer at f9020000 { #address-cells = <1>; #size-cells = <1>;Signature · 2 lines
QUALCOMM INDIA, on behalf of Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum, hosted by The Linux Foundation
PATCH v6 8/11 arm: dts: apq8064: Add thermal zones, tsens and qfprom nodes
In reply to Rajendra NayakTSENS is part of GCC, hence add TSENS properties as part of GCC node. Also add thermal zones and qfprom nodes.
Update GCC bindings doc to mention the possibility of optional TSENS properties that can be part of GCC node.
--- .../devicetree/bindings/clock/qcom,gcc.txt | 18 ++++ arch/arm/boot/dts/qcom-apq8064.dtsi | 103 +++++++++++++++++++++ 2 files changed, 121 insertions(+)
Documentation/devicetree/bindings/clock/qcom,gcc.txt +18 -0
@@ -23,6 +23,13 @@ Required properties : Optional properties : - #power-domain-cells : shall contain 1 +Optional properties: +- Qualcomm TSENS (thermal sensor device) on some devices can +be part of GCC and hence the TSENS properties can also be +part of the GCC/clock-controller node. +For more details on the TSENS properties please refer +Documentation/devicetree/bindings/thermal/qcom-tsens.txt + Example: clock-controller at 900000 { compatible = "qcom,gcc-msm8960";
@@ -31,3 +38,14 @@ Example: #reset-cells = <1>; #power-domain-cells = <1>; }; + +Example of GCC with TSENS properties: + clock-controller at 900000 { + compatible = "qcom,gcc-apq8064"; + reg = <0x00900000 0x4000>; + nvmem-cells = <&tsens_calib>, <&tsens_backup>; + nvmem-cell-names = "calib", "calib_backup"; + #clock-cells = <1>; + #reset-cells = <1>; + #thermal-sensor-cells = <1>; + };
arch/arm/boot/dts/qcom-apq8064.dtsi +103 -0
120 lines not on this page · raw message
Signature · 2 lines
QUALCOMM INDIA, on behalf of Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum, hosted by The Linux Foundation
PATCH v6 9/11 arm: dts: apq8084: Add thermal zones, tsens and qfprom nodes
In reply to Rajendra NayakAdd thermal zones, tsens and qfprom nodes
--- arch/arm/boot/dts/qcom-apq8084.dtsi | 103 ++++++++++++++++++++++++++++++++++++ 1 file changed, 103 insertions(+)
arch/arm/boot/dts/qcom-apq8084.dtsi +103 -0
@@ -86,6 +86,88 @@ }; }; + thermal-zones { + cpu-thermal0 { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens 5>; + + trips { + cpu_alert0: trip at 0 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + }; + cpu_crit0: trip at 1 { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + + cpu-thermal1 { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens 6>; + + trips { + cpu_alert1: trip at 0 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + }; + cpu_crit1: trip at 1 { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + + cpu-thermal2 { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens 7>; + + trips { + cpu_alert2: trip at 0 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + }; + cpu_crit2: trip at 1 { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + + cpu-thermal3 { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens 8>; + + trips { + cpu_alert3: trip at 0 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + }; + cpu_crit3: trip at 1 { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + }; + cpu-pmu { compatible = "qcom,krait-pmu"; interrupts = <1 7 0xf04>;
@@ -142,6 +224,27 @@ reg = <0xf9011000 0x1000>; }; + qfprom: qfprom at fc4bc000 { + #address-cells = <1>; + #size-cells = <1>; + compatible = "qcom,qfprom"; + reg = <0xfc4bc000 0x1000>; + tsens_calib: calib at d0 { + reg = <0xd0 0x18>; + }; + tsens_backup: backup at 440 { + reg = <0x440 0x10>; + }; + }; + + tsens: thermal-sensor at fc4a8000 { + compatible = "qcom,msm8974-tsens"; + reg = <0xfc4a8000 0x2000>; + nvmem-cells = <&tsens_calib>, <&tsens_backup>; + nvmem-cell-names = "calib", "calib_backup"; + #thermal-sensor-cells = <1>; + }; + timer at f9020000 { #address-cells = <1>; #size-cells = <1>;
Signature · 2 lines
QUALCOMM INDIA, on behalf of Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum, hosted by The Linux Foundation
PATCH v6 10/11 arm64: dts: msm8916: Add thermal zones, tsens and qfprom nodes
In reply to Rajendra NayakAdd thermal zones, tsens and qfprom nodes
--- arch/arm64/boot/dts/qcom/msm8916.dtsi | 64 +++++++++++++++++++++++++++++++++++ 1 file changed, 64 insertions(+)
arch/arm64/boot/dts/qcom/msm8916.dtsi +64 -0
@@ -98,6 +98,49 @@ }; }; + thermal-zones { + cpu-thermal0 { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens 4>; + + trips { + cpu_alert0: trip at 0 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + }; + cpu_crit0: trip at 1 { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + + cpu-thermal1 { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens 3>; + + trips { + cpu_alert1: trip at 0 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + }; + cpu_crit1: trip at 1 { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + + }; + timer { compatible = "arm,armv8-timer"; interrupts = <GIC_PPI 2 (GIC_CPU_MASK_SIMPLE(4) | IRQ_TYPE_LEVEL_LOW)>,
@@ -544,6 +587,27 @@ clocks = <&gcc GCC_PRNG_AHB_CLK>; clock-names = "core"; }; + + qfprom: qfprom at 5c000 { + compatible = "qcom,qfprom"; + reg = <0x5c000 0x1000>; + #address-cells = <1>; + #size-cells = <1>; + tsens_caldata: caldata at d0 { + reg = <0xd0 0x8>; + }; + tsens_calsel: calsel at ec { + reg = <0xec 0x4>; + }; + }; + + tsens: thermal-sensor at 4a8000 { + compatible = "qcom,msm8916-tsens"; + reg = <0x4a8000 0x2000>; + nvmem-cells = <&tsens_caldata>, <&tsens_calsel>; + nvmem-cell-names = "calib", "calib_sel"; + #thermal-sensor-cells = <1>; + }; }; smd {
Signature · 2 lines
QUALCOMM INDIA, on behalf of Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum, hosted by The Linux Foundation
PATCH v6 11/11 arm64: dts: msm8996: Add thermal zones, tsens and qfprom nodes
In reply to Rajendra NayakAdd thermal zones, tsens and qfprom nodes
--- arch/arm64/boot/dts/qcom/msm8996.dtsi | 92 +++++++++++++++++++++++++++++++++++ 1 file changed, 92 insertions(+)
arch/arm64/boot/dts/qcom/msm8996.dtsi +92 -0
@@ -97,6 +97,92 @@ }; }; + thermal-zones { + cpu-thermal0 { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 3>; + + trips { + cpu_alert0: trip at 0 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu_crit0: trip at 1 { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + + cpu-thermal1 { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 5>; + + trips { + cpu_alert1: trip at 0 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu_crit1: trip at 1 { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + + cpu-thermal2 { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 8>; + + trips { + cpu_alert2: trip at 0 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu_crit2: trip at 1 { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + + cpu-thermal3 { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 10>; + + trips { + cpu_alert3: trip at 0 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu_crit3: trip at 1 { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + }; + timer { compatible = "arm,armv8-timer"; interrupts = <GIC_PPI 13 (GIC_CPU_MASK_SIMPLE(4) | IRQ_TYPE_LEVEL_LOW)>,
@@ -151,6 +237,12 @@ reg = <0x300000 0x90000>; }; + tsens0: thermal-sensor at 4a8000 { + compatible = "qcom,msm8996-tsens"; + reg = <0x4a8000 0x2000>; + #thermal-sensor-cells = <1>; + }; + blsp2_uart1: serial at 75b0000 { compatible = "qcom,msm-uartdm-v1.4", "qcom,msm-uartdm"; reg = <0x75b0000 0x1000>;
Signature · 2 lines
QUALCOMM INDIA, on behalf of Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum, hosted by The Linux Foundation
v6 cover qcom: Add support for TSENS driver
In reply to Rajendra NayakEduardo,
Quoted 3 lines · Rajendra Nayak
Current set of patches apply on 4.6-rc6. Fixes for the nvmem apis are now posted [1] and queued in -next [2]
Patches [1-6] will need to be merged via thermal tree/Eduardo.
Any plans to pull these in for 4.8?
regards,
Rajendra
Quoted 92 lines
Patches [7-11] will need to go via qcom-msm tree/Andy.
Changes since v5:
* Minor review fixes from EduardoChanges since v4:
* dropped qcom,tsens-slopes binding, used coefficients instead
* dropped qcom,sensor-id binding
* Added support for msm8996 family
* Other minor review fixes from v4Changes since v3:
* Dropped 'clk: qcom: create virtual child device for TSENS' which is picked up by Stephen
* Updated GCC bindings with optional TSENS propertiesChanges since v2:
* Minor review fixes from Stephen/Punit and rebase on 4.3-rc4Changes since v1:
* Created virtual tsens device from gcc driver for 8960, with DT having a single node for gcc and tsens
* Minor fixes with rebasing on 4.3-rc1Changes since RFC:
* Added support for 8916 and 8084
* Based off the latest nvmem framework patches [1]
* Minor review fixes for comments mostly from LinaThis is an attempt to have a single TSENS driver for
the different versions of the TSENS IP that exist, on different qcom msm/apq SoCs'
Support is added for msm8916, msm8960, msm8974 and msm8996 families.A lot of the work is based of original code from Stephen Boyd and Siddartha Mohanadoss. I have also picked some of what Narendran Rajan did in his attempt to upstream the support for 8960 family. I could not keep the original authorship on any of the patches because I ended up moving the code around quite a bit in an effort to have a single driver for the various devices. I would be glad to change the authorship for any of the patches if needed.
[1] https://lkml.org/lkml/2016/4/24/103
[2]git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc.gitchar-misc-nextRajendra Nayak (11):
thermal: qcom: tsens: Add a skeletal TSENS drivers
thermal: qcom: tsens-8916: Add support for 8916 family of SoCs
thermal: qcom: tsens-8974: Add support for 8974 family of SoCs
thermal: core: export apis to get slope and offset
thermal: qcom: tsens-8960: Add support for 8960 family of SoCs
thermal: qcom: tsens-8996: Add support for 8996 family of SoCs
arm: dts: msm8974: Add thermal zones, tsens and qfprom nodes
arm: dts: apq8064: Add thermal zones, tsens and qfprom nodes
arm: dts: apq8084: Add thermal zones, tsens and qfprom nodes
arm64: dts: msm8916: Add thermal zones, tsens and qfprom nodes
arm64: dts: msm8996: Add thermal zones, tsens and qfprom nodes.../devicetree/bindings/clock/qcom,gcc.txt | 18 ++ .../devicetree/bindings/thermal/qcom-tsens.txt | 21 ++ Documentation/thermal/sysfs-api.txt | 12 + arch/arm/boot/dts/qcom-apq8064.dtsi | 103 ++++++++ arch/arm/boot/dts/qcom-apq8084.dtsi | 103 ++++++++ arch/arm/boot/dts/qcom-msm8974.dtsi | 103 ++++++++ arch/arm64/boot/dts/qcom/msm8916.dtsi | 64 +++++ arch/arm64/boot/dts/qcom/msm8996.dtsi | 92 +++++++ drivers/thermal/Kconfig | 5 + drivers/thermal/Makefile | 1 + drivers/thermal/qcom/Kconfig | 11 + drivers/thermal/qcom/Makefile | 2 + drivers/thermal/qcom/tsens-8916.c | 113 ++++++++ drivers/thermal/qcom/tsens-8960.c | 292 +++++++++++++++++++++ drivers/thermal/qcom/tsens-8974.c | 244 +++++++++++++++++ drivers/thermal/qcom/tsens-8996.c | 84 ++++++ drivers/thermal/qcom/tsens-common.c | 141 ++++++++++ drivers/thermal/qcom/tsens.c | 200 ++++++++++++++ drivers/thermal/qcom/tsens.h | 92 +++++++ drivers/thermal/thermal_core.c | 30 +++ include/linux/thermal.h | 8 + 21 files changed, 1739 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/qcom-tsens.txt create mode 100644 drivers/thermal/qcom/Kconfig create mode 100644 drivers/thermal/qcom/Makefile create mode 100644 drivers/thermal/qcom/tsens-8916.c create mode 100644 drivers/thermal/qcom/tsens-8960.c create mode 100644 drivers/thermal/qcom/tsens-8974.c create mode 100644 drivers/thermal/qcom/tsens-8996.c create mode 100644 drivers/thermal/qcom/tsens-common.c create mode 100644 drivers/thermal/qcom/tsens.c create mode 100644 drivers/thermal/qcom/tsens.h
Signature · 2 lines
Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum, hosted by The Linux Foundation
v6 cover qcom: Add support for TSENS driver
Hey Eduardo,
Quoted 8 lines · Rajendra Nayak
Eduardo,
Quoted 3 lines · Rajendra Nayak
Current set of patches apply on 4.6-rc6. Fixes for the nvmem apis are now posted [1] and queued in -next [2]
Patches [1-6] will need to be merged via thermal tree/Eduardo.Any plans to pull these in for 4.8?
These patches have been on the list for quite a while, and they do not have any outstanding dependencies or comments to be addressed. I would really hope to see these in for 4.8. Let me know if there is something you want me to address before you pull them in.
regards,
Rajendra
Quoted 97 lines
regards,
RajendraQuoted 92 lines
Patches [7-11] will need to go via qcom-msm tree/Andy.
Changes since v5:
* Minor review fixes from EduardoChanges since v4:
* dropped qcom,tsens-slopes binding, used coefficients instead
* dropped qcom,sensor-id binding
* Added support for msm8996 family
* Other minor review fixes from v4Changes since v3:
* Dropped 'clk: qcom: create virtual child device for TSENS' which is picked up by Stephen
* Updated GCC bindings with optional TSENS propertiesChanges since v2:
* Minor review fixes from Stephen/Punit and rebase on 4.3-rc4Changes since v1:
* Created virtual tsens device from gcc driver for 8960, with DT having a single node for gcc and tsens
* Minor fixes with rebasing on 4.3-rc1Changes since RFC:
* Added support for 8916 and 8084
* Based off the latest nvmem framework patches [1]
* Minor review fixes for comments mostly from LinaThis is an attempt to have a single TSENS driver for
the different versions of the TSENS IP that exist, on different qcom msm/apq SoCs'
Support is added for msm8916, msm8960, msm8974 and msm8996 families.A lot of the work is based of original code from Stephen Boyd and Siddartha Mohanadoss. I have also picked some of what Narendran Rajan did in his attempt to upstream the support for 8960 family. I could not keep the original authorship on any of the patches because I ended up moving the code around quite a bit in an effort to have a single driver for the various devices. I would be glad to change the authorship for any of the patches if needed.
[1] https://lkml.org/lkml/2016/4/24/103
[2]git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc.gitchar-misc-nextRajendra Nayak (11):
thermal: qcom: tsens: Add a skeletal TSENS drivers
thermal: qcom: tsens-8916: Add support for 8916 family of SoCs
thermal: qcom: tsens-8974: Add support for 8974 family of SoCs
thermal: core: export apis to get slope and offset
thermal: qcom: tsens-8960: Add support for 8960 family of SoCs
thermal: qcom: tsens-8996: Add support for 8996 family of SoCs
arm: dts: msm8974: Add thermal zones, tsens and qfprom nodes
arm: dts: apq8064: Add thermal zones, tsens and qfprom nodes
arm: dts: apq8084: Add thermal zones, tsens and qfprom nodes
arm64: dts: msm8916: Add thermal zones, tsens and qfprom nodes
arm64: dts: msm8996: Add thermal zones, tsens and qfprom nodes.../devicetree/bindings/clock/qcom,gcc.txt | 18 ++ .../devicetree/bindings/thermal/qcom-tsens.txt | 21 ++ Documentation/thermal/sysfs-api.txt | 12 + arch/arm/boot/dts/qcom-apq8064.dtsi | 103 ++++++++ arch/arm/boot/dts/qcom-apq8084.dtsi | 103 ++++++++ arch/arm/boot/dts/qcom-msm8974.dtsi | 103 ++++++++ arch/arm64/boot/dts/qcom/msm8916.dtsi | 64 +++++ arch/arm64/boot/dts/qcom/msm8996.dtsi | 92 +++++++ drivers/thermal/Kconfig | 5 + drivers/thermal/Makefile | 1 + drivers/thermal/qcom/Kconfig | 11 + drivers/thermal/qcom/Makefile | 2 + drivers/thermal/qcom/tsens-8916.c | 113 ++++++++ drivers/thermal/qcom/tsens-8960.c | 292 +++++++++++++++++++++ drivers/thermal/qcom/tsens-8974.c | 244 +++++++++++++++++ drivers/thermal/qcom/tsens-8996.c | 84 ++++++ drivers/thermal/qcom/tsens-common.c | 141 ++++++++++ drivers/thermal/qcom/tsens.c | 200 ++++++++++++++ drivers/thermal/qcom/tsens.h | 92 +++++++ drivers/thermal/thermal_core.c | 30 +++ include/linux/thermal.h | 8 + 21 files changed, 1739 insertions(+)create mode 100644
Documentation/devicetree/bindings/thermal/qcom-tsens.txtcreate mode 100644drivers/thermal/qcom/Kconfig
create mode 100644drivers/thermal/qcom/Makefile
create mode 100644drivers/thermal/qcom/tsens-8916.c
create mode 100644drivers/thermal/qcom/tsens-8960.c
create mode 100644drivers/thermal/qcom/tsens-8974.c
create mode 100644drivers/thermal/qcom/tsens-8996.c
create mode 100644drivers/thermal/qcom/tsens-common.c
create mode 100644drivers/thermal/qcom/tsens.c
create mode 100644drivers/thermal/qcom/tsens.h
v6 cover qcom: Add support for TSENS driver
Rui,
Quoted 10 lines · Rajendra
Hey Eduardo,
Quoted 7 lines · Rajendra Nayak
Eduardo,
Quoted 3 lines · Rajendra Nayak
Current set of patches apply on 4.6-rc6. Fixes for the nvmem apis are now posted [1] and queued in -next [2]
Patches [1-6] will need to be merged via thermal tree/Eduardo.
Quoted 7 lines
Quoted 1 line
Any plans to pull these in for 4.8?
These patches have been on the list for quite a while, and they do not have any outstanding dependencies or comments to be addressed. I would really hope to see these in for 4.8. Let me know if there is something you want me to address before you pull them in.
Would you be able to pull this driver in? I haven't heard back anything from Eduardo despite multiple pings.
These patches (v6) have been on the list for a couple months now, which address all issues/concerns that were raised by Eduardo in his previous reviews.
regards,
Rajendra
Quoted 101 lines
regards,
RajendraQuoted 97 lines
regards,
RajendraQuoted 92 lines
Patches [7-11] will need to go via qcom-msm tree/Andy.
Changes since v5:
* Minor review fixes from EduardoChanges since v4:
* dropped qcom,tsens-slopes binding, used coefficients instead
* dropped qcom,sensor-id binding
* Added support for msm8996 family
* Other minor review fixes from v4Changes since v3:
* Dropped 'clk: qcom: create virtual child device for TSENS' which is picked up by Stephen
* Updated GCC bindings with optional TSENS propertiesChanges since v2:
* Minor review fixes from Stephen/Punit and rebase on 4.3-rc4Changes since v1:
* Created virtual tsens device from gcc driver for 8960, with DT having a single node for gcc and tsens
* Minor fixes with rebasing on 4.3-rc1Changes since RFC:
* Added support for 8916 and 8084
* Based off the latest nvmem framework patches [1]
* Minor review fixes for comments mostly from LinaThis is an attempt to have a single TSENS driver for
the different versions of the TSENS IP that exist, on different qcom msm/apq SoCs'
Support is added for msm8916, msm8960, msm8974 and msm8996 families.A lot of the work is based of original code from Stephen Boyd and Siddartha Mohanadoss. I have also picked some of what Narendran Rajan did in his attempt to upstream the support for 8960 family. I could not keep the original authorship on any of the patches because I ended up moving the code around quite a bit in an effort to have a single driver for the various devices. I would be glad to change the authorship for any of the patches if needed.
[1] https://lkml.org/lkml/2016/4/24/103
[2]git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-misc.gitchar-misc-nextRajendra Nayak (11):
thermal: qcom: tsens: Add a skeletal TSENS drivers
thermal: qcom: tsens-8916: Add support for 8916 family of SoCs
thermal: qcom: tsens-8974: Add support for 8974 family of SoCs
thermal: core: export apis to get slope and offset
thermal: qcom: tsens-8960: Add support for 8960 family of SoCs
thermal: qcom: tsens-8996: Add support for 8996 family of SoCs
arm: dts: msm8974: Add thermal zones, tsens and qfprom nodes
arm: dts: apq8064: Add thermal zones, tsens and qfprom nodes
arm: dts: apq8084: Add thermal zones, tsens and qfprom nodes
arm64: dts: msm8916: Add thermal zones, tsens and qfprom nodes
arm64: dts: msm8996: Add thermal zones, tsens and qfprom nodes.../devicetree/bindings/clock/qcom,gcc.txt | 18 ++ .../devicetree/bindings/thermal/qcom-tsens.txt | 21 ++ Documentation/thermal/sysfs-api.txt | 12 + arch/arm/boot/dts/qcom-apq8064.dtsi | 103 ++++++++ arch/arm/boot/dts/qcom-apq8084.dtsi | 103 ++++++++ arch/arm/boot/dts/qcom-msm8974.dtsi | 103 ++++++++ arch/arm64/boot/dts/qcom/msm8916.dtsi | 64 +++++ arch/arm64/boot/dts/qcom/msm8996.dtsi | 92 +++++++ drivers/thermal/Kconfig | 5 + drivers/thermal/Makefile | 1 + drivers/thermal/qcom/Kconfig | 11 + drivers/thermal/qcom/Makefile | 2 + drivers/thermal/qcom/tsens-8916.c | 113 ++++++++ drivers/thermal/qcom/tsens-8960.c | 292 +++++++++++++++++++++ drivers/thermal/qcom/tsens-8974.c | 244 +++++++++++++++++ drivers/thermal/qcom/tsens-8996.c | 84 ++++++ drivers/thermal/qcom/tsens-common.c | 141 ++++++++++ drivers/thermal/qcom/tsens.c | 200 ++++++++++++++ drivers/thermal/qcom/tsens.h | 92 +++++++ drivers/thermal/thermal_core.c | 30 +++ include/linux/thermal.h | 8 + 21 files changed, 1739 insertions(+)create mode 100644
Documentation/devicetree/bindings/thermal/qcom-tsens.txtcreate mode 100644drivers/thermal/qcom/Kconfig
create mode 100644drivers/thermal/qcom/Makefile
create mode 100644drivers/thermal/qcom/tsens-8916.c
create mode 100644drivers/thermal/qcom/tsens-8960.c
create mode 100644drivers/thermal/qcom/tsens-8974.c
create mode 100644drivers/thermal/qcom/tsens-8996.c
create mode 100644drivers/thermal/qcom/tsens-common.c
create mode 100644drivers/thermal/qcom/tsens.c
create mode 100644drivers/thermal/qcom/tsens.h
Signature · 2 lines
Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum, hosted by The Linux Foundation
v6 cover qcom: Add support for TSENS driver
Quoted 21 lines · Rajendra Nayak
Rui,
Quoted 10 lines · Rajendra
Hey Eduardo,
Quoted 7 lines · Rajendra Nayak
Eduardo,
Quoted 3 lines · Rajendra Nayak
Current set of patches apply on 4.6-rc6. Fixes for the nvmem apis are now posted [1] and queued in -next [2]
Patches [1-6] will need to be merged via thermal tree/Eduardo.Quoted 7 lines
Quoted 1 line
Any plans to pull these in for 4.8?
These patches have been on the list for quite a while, and they do not have any outstanding dependencies or comments to be addressed. I would really hope to see these in for 4.8. Let me know if there is something you want me to address before you pull them in.
Quoted 5 lines
Would you be able to pull this driver in? I haven't heard back anything from Eduardo despite multiple pings.
These patches (v6) have been on the list for a couple months now, which address all issues/concerns that were raised by Eduardo in his previous reviews.
Apologize for the late answer. I will take care of queueing them.
BR,
v6 cover qcom: Add support for TSENS driver
Quoted 22 lines · Eduardo Valentin
Quoted 21 lines · Rajendra Nayak
Rui,
Quoted 17 lines · Rajendra
Hey Eduardo,
Quoted 8 lines · Rajendra Nayak
Eduardo,
Quoted 3 lines · Rajendra Nayak
Current set of patches apply on 4.6-rc6. Fixes for the nvmem apis are now posted [1] and queued in -next [2]
Patches [1-6] will need to be merged via thermal tree/Eduardo.Any plans to pull these in for 4.8?
These patches have been on the list for quite a while, and they do not have any outstanding dependencies or comments to be addressed. I would really hope to see these in for 4.8. Let me know if there is something you want me to address before you pull them in.
Quoted 7 lines
Quoted 5 lines
Would you be able to pull this driver in? I haven't heard back anything from Eduardo despite multiple pings.
These patches (v6) have been on the list for a couple months now, which address all issues/concerns that were raised by Eduardo in his previous reviews.Apologize for the late answer. I will take care of queueing them.
Applied patches 1-6. The DT patches lack the cooling map, on all of them. In case you do not have a working cooling device in your platform, at least add an empty map with a TODO flag.
After you fix the DT patch, you may add my
on them.
Quoted 3 lines
BR,
v6 cover qcom: Add support for TSENS driver
Quoted 29 lines · Eduardo Valentin
Quoted 28 lines · Eduardo Valentin
Quoted 26 lines · Rajendra Nayak
Rui,
Quoted 10 lines · Rajendra
Hey Eduardo,
Quoted 7 lines · Rajendra Nayak
Eduardo,
Quoted 3 lines · Rajendra Nayak
Current set of patches apply on 4.6-rc6. Fixes for the nvmem apis are now posted [1] and queued in -next [2]
Patches [1-6] will need to be merged via thermal tree/Eduardo.Quoted 7 lines
Quoted 1 line
Any plans to pull these in for 4.8?
These patches have been on the list for quite a while, and they do not have any outstanding dependencies or comments to be addressed. I would really hope to see these in for 4.8. Let me know if there is something you want me to address before you pull them in.
Would you be able to pull this driver in? I haven't heard back anything from Eduardo despite multiple pings.
These patches (v6) have been on the list for a couple months now, which address all issues/concerns that were raised by Eduardo in his previous reviews.
Quoted 5 lines
Quoted 1 line
Apologize for the late answer. I will take care of queueing them.
Applied patches 1-6. The DT patches lack the cooling map, on all of them. In case you do not have a working cooling device in your platform, at least add an empty map with a TODO flag.
Thanks Eduardo. I will add empty maps in cases where CPUfreq support is still missing.
Quoted 10 lines
After you fix the DT patch, you may add my
Acked-by Eduardo Valentin <[email protected]>on them.
Quoted 3 lines
BR,
Zhang Rui
reviewerv6 cover qcom: Add support for TSENS driver
In reply to Rajendra NayakHi, Rajendra,
Quoted 22 lines · Rajendra Nayak
Rui,
Quoted 13 lines · Rajendra
Hey Eduardo,
Quoted 9 lines · Rajendra Nayak
Eduardo,
Quoted 5 lines · Rajendra Nayak
Current set of patches apply on 4.6-rc6. Fixes for the nvmem apis
are now posted [1] and queued in -next [2]
Patches [1-6] will need to be merged via thermal tree/Eduardo.Quoted 6 lines
Quoted 1 line
Any plans to pull these in for 4.8?
These patches have been on the list for quite a while, and they do not have any outstanding dependencies or comments to be addressed. I would really hope to see these in for 4.8. Let me know if there is something you want me to address before you pull them in.
Quoted 6 lines
Would you be able to pull this driver in? I haven't heard back anything from Eduardo despite multiple pings.
These patches (v6) have been on the list for a couple months now, which address all issues/concerns that were raised by Eduardo in his previous reviews.
Sorry for my late response as I took medical leave earlier this month for a noise surgery and I'm just back to work.
I synced with Eduardo yesterday, he was also really busy recently, but he will go through the pending patches soon.
So, for this patch set, I still prefer to let Eduardo to take it if he has time, and I will take them if you still don't get feedback from Eduardo after the merge window, does this sound okay for you?
thanks,
rui
Quoted 128 lines
regards,
RajendraQuoted 125 lines
regards,
RajendraQuoted 120 lines
regards,
RajendraQuoted 115 lines
Patches [7-11] will need to go via qcom-msm tree/Andy.
Changes since v5:
* Minor review fixes from EduardoChanges since v4:
* dropped qcom,tsens-slopes binding, used coefficients instead
* dropped qcom,sensor-id binding
* Added support for msm8996 family
* Other minor review fixes from v4Changes since v3:
* Dropped 'clk: qcom: create virtual child device for TSENS' which
is picked up by Stephen
* Updated GCC bindings with optional TSENS propertiesChanges since v2:
* Minor review fixes from Stephen/Punit and rebase on 4.3-rc4Changes since v1:
* Created virtual tsens device from gcc driver for 8960, with DT having a single node for gcc and tsens
* Minor fixes with rebasing on 4.3-rc1Changes since RFC:
* Added support for 8916 and 8084
* Based off the latest nvmem framework patches [1]
* Minor review fixes for comments mostly from LinaThis is an attempt to have a single TSENS driver for the different versions of the TSENS IP that exist, on different qcom msm/apq SoCs'
Support is added for msm8916, msm8960, msm8974 and msm8996 families.A lot of the work is based of original code from Stephen Boyd and Siddartha Mohanadoss. I have also picked some of what Narendran Rajan did in his attempt to upstream the support for 8960 family. I could not keep the original authorship on any of the patches because I ended up moving the code around quite a bit in an effort to have a single driver for the various devices. I would be glad to change the authorship for any of the patches if needed.
[1] https://lkml.org/lkml/2016/4/24/103
[2]git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-
misc.git char-misc-nextRajendra Nayak (11):
???thermal: qcom: tsens: Add a skeletal TSENS drivers ???thermal: qcom: tsens-8916: Add support for 8916 family of SoCs
???thermal: qcom: tsens-8974: Add support for 8974 family of SoCs
???thermal: core: export apis to get slope and offset ???thermal: qcom: tsens-8960: Add support for 8960 family of SoCs
???thermal: qcom: tsens-8996: Add support for 8996 family of SoCs
???arm: dts: msm8974: Add thermal zones, tsens and qfprom nodes ???arm: dts: apq8064: Add thermal zones, tsens and qfprom nodes ???arm: dts: apq8084: Add thermal zones, tsens and qfprom nodes ???arm64: dts: msm8916: Add thermal zones, tsens and qfprom nodes
???arm64: dts: msm8996: Add thermal zones, tsens and qfprom nodes? .../devicetree/bindings/clock/qcom,gcc.txt?????????|??18 ++ ? .../devicetree/bindings/thermal/qcom-tsens.txt?????|??21 ++ ? Documentation/thermal/sysfs-api.txt????????????????|??12 + ? arch/arm/boot/dts/qcom-apq8064.dtsi????????????????| 103++++++++
? arch/arm/boot/dts/qcom-apq8084.dtsi????????????????| 103
++++++++
? arch/arm/boot/dts/qcom-msm8974.dtsi????????????????| 103
++++++++
? arch/arm64/boot/dts/qcom/msm8916.dtsi??????????????|??64
+++++
? arch/arm64/boot/dts/qcom/msm8996.dtsi??????????????|??92
+++++++? drivers/thermal/Kconfig????????????????????????????|???5 + ? drivers/thermal/Makefile???????????????????????????|???1 + ? drivers/thermal/qcom/Kconfig???????????????????????|??11 + ? drivers/thermal/qcom/Makefile??????????????????????|???2 + ? drivers/thermal/qcom/tsens-8916.c??????????????????| 113++++++++
? drivers/thermal/qcom/tsens-8960.c??????????????????| 292
+++++++++++++++++++++
? drivers/thermal/qcom/tsens-8974.c??????????????????| 244
+++++++++++++++++
? drivers/thermal/qcom/tsens-8996.c??????????????????|??84
++++++
? drivers/thermal/qcom/tsens-common.c????????????????| 141
++++++++++
? drivers/thermal/qcom/tsens.c???????????????????????| 200
++++++++++++++
? drivers/thermal/qcom/tsens.h???????????????????????|??92
+++++++
? drivers/thermal/thermal_core.c?????????????????????|??30 +++ ? include/linux/thermal.h????????????????????????????|???8 + ? 21 files changed, 1739 insertions(+)
? create mode 100644Documentation/devicetree/bindings/thermal/qcom-tsens.txt? create mode 100644drivers/thermal/qcom/Kconfig
? create mode 100644drivers/thermal/qcom/Makefile
? create mode 100644drivers/thermal/qcom/tsens-8916.c? create mode 100644drivers/thermal/qcom/tsens-8960.c? create mode 100644drivers/thermal/qcom/tsens-8974.c? create mode 100644drivers/thermal/qcom/tsens-8996.c? create mode 100644drivers/thermal/qcom/tsens-common.c? create mode 100644drivers/thermal/qcom/tsens.c
? create mode 100644drivers/thermal/qcom/tsens.h
Zhang Rui
reviewerv6 cover qcom: Add support for TSENS driver
Quoted 39 lines · Zhang Rui
Hi, Rajendra,
Quoted 27 lines · Rajendra Nayak
Rui,
Quoted 17 lines · Rajendra
Hey Eduardo,
Quoted 12 lines · Rajendra Nayak
Eduardo,
Quoted 7 lines · Rajendra Nayak
Current set of patches apply on 4.6-rc6. Fixes for the nvmem apis
are now posted [1] and queued in -next [2]
Patches [1-6] will need to be merged via thermal tree/Eduardo.Quoted 6 lines
Quoted 1 line
Any plans to pull these in for 4.8?
These patches have been on the list for quite a while, and they do not have any outstanding dependencies or comments to be addressed. I would really hope to see these in for 4.8. Let me know if there is something you want me to address before you pull them in.
Quoted 6 lines
Would you be able to pull this driver in? I haven't heard back anything from Eduardo despite multiple pings.
These patches (v6) have been on the list for a couple months now, which address all issues/concerns that were raised by Eduardo in his previous reviews.Sorry for my late response as I took medical leave earlier this month for a noise surgery and I'm just back to work.
Quoted 8 lines
I synced with Eduardo yesterday, he was also really busy recently, but
he will go through the pending patches soon.
So, for this patch set, I still prefer to let Eduardo to take it if he
has time, and I will take them if you still don't get feedback from Eduardo after the merge window, does this sound okay for you?
Hah, it seems that Eduardo has already took your patches, sorry for the noise. :)
thanks,
rui
Quoted 146 lines
thanks,
ruiQuoted 138 lines
regards,
RajendraQuoted 134 lines
regards,
RajendraQuoted 128 lines
regards,
RajendraQuoted 122 lines
Patches [7-11] will need to go via qcom-msm tree/Andy.
Changes since v5:
* Minor review fixes from EduardoChanges since v4:
* dropped qcom,tsens-slopes binding, used coefficients instead
* dropped qcom,sensor-id binding
* Added support for msm8996 family
* Other minor review fixes from v4Changes since v3:
* Dropped 'clk: qcom: create virtual child device for TSENS' which
is picked up by Stephen
* Updated GCC bindings with optional TSENS propertiesChanges since v2:
* Minor review fixes from Stephen/Punit and rebase on 4.3-rc4Changes since v1:
* Created virtual tsens device from gcc driver for 8960, with DT having a single node for gcc and tsens
* Minor fixes with rebasing on 4.3-rc1Changes since RFC:
* Added support for 8916 and 8084
* Based off the latest nvmem framework patches [1]
* Minor review fixes for comments mostly from LinaThis is an attempt to have a single TSENS driver for the different versions of the TSENS IP that exist, on different qcom msm/apq SoCs'
Support is added for msm8916, msm8960, msm8974 and msm8996 families.A lot of the work is based of original code from Stephen Boyd and Siddartha Mohanadoss. I have also picked some of what Narendran Rajan did in his attempt to upstream the support for 8960 family. I could not keep the original authorship on any of the patches because I ended up moving the code around quite a bit in an effort to have a single driver for the various devices. I would be glad to change the authorship for any of the patches if needed.
[1] https://lkml.org/lkml/2016/4/24/103
[2]git://git.kernel.org/pub/scm/linux/kernel/git/gregkh/char-
misc.git char-misc-nextRajendra Nayak (11):
???thermal: qcom: tsens: Add a skeletal TSENS drivers ???thermal: qcom: tsens-8916: Add support for 8916 family of SoCs
???thermal: qcom: tsens-8974: Add support for 8974 family of SoCs
???thermal: core: export apis to get slope and offset ???thermal: qcom: tsens-8960: Add support for 8960 family of SoCs
???thermal: qcom: tsens-8996: Add support for 8996 family of SoCs
???arm: dts: msm8974: Add thermal zones, tsens and qfprom nodes
???arm: dts: apq8064: Add thermal zones, tsens and qfprom nodes
???arm: dts: apq8084: Add thermal zones, tsens and qfprom nodes
???arm64: dts: msm8916: Add thermal zones, tsens and qfprom nodes
???arm64: dts: msm8996: Add thermal zones, tsens and qfprom nodes? .../devicetree/bindings/clock/qcom,gcc.txt?????????|??18 ++ ? .../devicetree/bindings/thermal/qcom-tsens.txt?????|??21 ++ ? Documentation/thermal/sysfs-api.txt????????????????|??12 + ? arch/arm/boot/dts/qcom-apq8064.dtsi????????????????| 103++++++++
? arch/arm/boot/dts/qcom-apq8084.dtsi????????????????| 103
++++++++
? arch/arm/boot/dts/qcom-msm8974.dtsi????????????????| 103
++++++++
? arch/arm64/boot/dts/qcom/msm8916.dtsi??????????????|??64
+++++
? arch/arm64/boot/dts/qcom/msm8996.dtsi??????????????|??92
+++++++? drivers/thermal/Kconfig????????????????????????????|???5 + ? drivers/thermal/Makefile???????????????????????????|???1 + ? drivers/thermal/qcom/Kconfig???????????????????????|??11 + ? drivers/thermal/qcom/Makefile??????????????????????|???2 + ? drivers/thermal/qcom/tsens-8916.c??????????????????| 113++++++++
? drivers/thermal/qcom/tsens-8960.c??????????????????| 292
+++++++++++++++++++++
? drivers/thermal/qcom/tsens-8974.c??????????????????| 244
+++++++++++++++++
? drivers/thermal/qcom/tsens-8996.c??????????????????|??84
++++++
? drivers/thermal/qcom/tsens-common.c????????????????| 141
++++++++++
? drivers/thermal/qcom/tsens.c???????????????????????| 200
++++++++++++++
? drivers/thermal/qcom/tsens.h???????????????????????|??92
+++++++
? drivers/thermal/thermal_core.c?????????????????????|??30
+++
? include/linux/thermal.h????????????????????????????|???8 + ? 21 files changed, 1739 insertions(+)
? create mode 100644Documentation/devicetree/bindings/thermal/qcom-tsens.txt? create mode 100644drivers/thermal/qcom/Kconfig? create mode 100644drivers/thermal/qcom/Makefile? create mode 100644drivers/thermal/qcom/tsens-8916.c? create mode 100644drivers/thermal/qcom/tsens-8960.c? create mode 100644drivers/thermal/qcom/tsens-8974.c? create mode 100644drivers/thermal/qcom/tsens-8996.c? create mode 100644drivers/thermal/qcom/tsens-common.c? create mode 100644drivers/thermal/qcom/tsens.c? create mode 100644drivers/thermal/qcom/tsens.h--
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v6 cover qcom: Add support for TSENS driver
[]..
Quoted 29 lines
Quoted 21 lines
Quoted 12 lines
Quoted 6 lines
Quoted 6 lines
Quoted 6 lines
Current set of patches apply on 4.6-rc6. Fixes for the nvmem apis
are now posted [1] and queued in -next [2]
Patches [1-6] will need to be merged via thermal tree/Eduardo.Quoted 6 lines
Quoted 1 line
Any plans to pull these in for 4.8?
These patches have been on the list for quite a while, and they do not have any outstanding dependencies or comments to be addressed. I would really hope to see these in for 4.8. Let me know if there is something you want me to address before you pull them in.
Quoted 6 lines
Would you be able to pull this driver in? I haven't heard back anything from Eduardo despite multiple pings.
These patches (v6) have been on the list for a couple months now, which address all issues/concerns that were raised by Eduardo in his previous reviews.Sorry for my late response as I took medical leave earlier this month for a noise surgery and I'm just back to work.
Quoted 8 lines
I synced with Eduardo yesterday, he was also really busy recently, but
he will go through the pending patches soon.
So, for this patch set, I still prefer to let Eduardo to take it if he
has time, and I will take them if you still don't get feedback from Eduardo after the merge window, does this sound okay for you?
Quoted 2 lines
Hah, it seems that Eduardo has already took your patches, sorry for the noise. :)
Hey Rui, yes, thanks, I was out the last couple weeks too so could not respond.
Quoted 5 lines
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Signature · 2 lines
Qualcomm Innovation Center, Inc. is a member of Code Aurora Forum, hosted by The Linux Foundation