usb: dwc3: add glue layer dependencies
Subsystems (2)
PATCH 1/1 usb: dwc3: add glue layer dependencies
Glue layers for the DWC3 driver only make sense on specific platforms. Add dependencies so that they are not built where they aren't needed.
Signed-off-by Jean Delvare <[email protected]>
Cc Felipe Balbi <[email protected]>
Cc Greg Kroah-Hartman <[email protected]>
Cc WingMan Kwok <[email protected]>
--- drivers/usb/dwc3/Kconfig | 4 +++- 1 file changed, 3 insertions(+), 1 deletion(-)
drivers/usb/dwc3/Kconfig +3 -1
@@ -44,7 +44,7 @@ comment "Platform Glue Driver Support" config USB_DWC3_OMAP tristate "Texas Instruments OMAP5 and similar Platforms" - depends on EXTCON + depends on EXTCON && (ARCH_OMAP2PLUS || COMPILE_TEST) default USB_DWC3 help Some platforms from Texas Instruments like OMAP5, DRA7xxx and
@@ -54,6 +54,7 @@ config USB_DWC3_OMAP config USB_DWC3_EXYNOS tristate "Samsung Exynos Platform" + depends on ARCH_EXYNOS || COMPILE_TEST default USB_DWC3 help Recent Exynos5 SoCs ship with one DesignWare Core USB3 IP inside,
@@ -72,6 +73,7 @@ config USB_DWC3_PCI config USB_DWC3_KEYSTONE tristate "Texas Instruments Keystone2 Platforms" + depends on ARCH_KEYSTONE || COMPILE_TEST default USB_DWC3 help Support of USB2/3 functionality in TI Keystone2 platforms.
Signature · 2 lines
Jean Delvare SUSE L3 Support