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usb: musb: Fix randconfig build issues for Kconfig options

PATCH In review Tony Lindgren 2 participants 2 messages Dec 1, 2014

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PATCH 1/1 usb: musb: Fix randconfig build issues for Kconfig options

Commit 82c02f58ba3a ("usb: musb: Allow multiple glue layers to be built in") enabled selecting multiple glue layers, which in turn exposed things more for randconfig builds. If NOP_USB_XCEIV is built-in and TUSB6010 is a loadable module, we will get:

drivers/built-in.o: In function `tusb_remove':
tusb6010.c:(.text+0x16a817): undefined reference to usb_phy_generic_unregister' drivers/built-in.o: In function tusb_probe':
tusb6010.c:(.text+0x16b24e): undefined reference to `usb_phy_generic_register'
make: *** [vmlinux] Error 1

Let's fix this the same way as commit 70c1ff4b3c86 ("usb: musb:
tusb-dma can't be built-in if tusb is not").

And while at it, let's not allow selecting the glue layers except on platforms really using them unless COMPILE_TEST is specified:

- TUSB6010 is in practise only used on omaps

- DSPS is only used on TI platforms

- UX500 is only used on STE platforms

---

Felipe, this is against current linux next for v3.19

drivers/usb/musb/Kconfig +4 -0
@@ -72,6 +72,8 @@ config USB_MUSB_DA8XX
 
 config USB_MUSB_TUSB6010
 	tristate "TUSB6010"
+	depends on ARCH_OMAP2PLUS || COMPILE_TEST
+	depends on NOP_USB_XCEIV = USB_MUSB_HDRC # both built-in or both modules
 
 config USB_MUSB_OMAP2PLUS
 	tristate "OMAP2430 and onwards"
@@ -85,6 +87,7 @@ config USB_MUSB_AM35X
 config USB_MUSB_DSPS
 	tristate "TI DSPS platforms"
 	select USB_MUSB_AM335X_CHILD
+	depends on ARCH_OMAP2PLUS || COMPILE_TEST
 	depends on OF_IRQ
 
 config USB_MUSB_BLACKFIN
@@ -93,6 +96,7 @@ config USB_MUSB_BLACKFIN
 
 config USB_MUSB_UX500
 	tristate "Ux500 platforms"
+	depends on ARCH_U8500 || COMPILE_TEST
 
 config USB_MUSB_JZ4740
 	tristate "JZ4740"

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#1 lore raw
Quoted 23 lines · Tony Lindgren

Commit 82c02f58ba3a ("usb: musb: Allow multiple glue layers to be built in") enabled selecting multiple glue layers, which in turn exposed things more for randconfig builds. If NOP_USB_XCEIV is built-in and TUSB6010 is a loadable module, we will get:

drivers/built-in.o: In function `tusb_remove':
tusb6010.c:(.text+0x16a817): undefined reference to usb_phy_generic_unregister' drivers/built-in.o: In function tusb_probe':
tusb6010.c:(.text+0x16b24e): undefined reference to `usb_phy_generic_register'
make: *** [vmlinux] Error 1

Let's fix this the same way as commit 70c1ff4b3c86 ("usb: musb:
tusb-dma can't be built-in if tusb is not").

And while at it, let's not allow selecting the glue layers except on platforms really using them unless COMPILE_TEST is specified:

- TUSB6010 is in practise only used on omaps

- DSPS is only used on TI platforms

- UX500 is only used on STE platforms

Quoted 7 lines

---

Felipe, this is against current linux next for v3.19

since this is actually an old bug which just showed up, I'll defer this to v3.19-rc1.

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