Bonding device documentation missing
https://bugs.dpdk.org/show_bug.cgi?id=1699
Bug ID: 1699
Summary: Bonding device documentation missing
Product: DPDK
Version: 25.03
Hardware: All
OS: All
Status: UNCONFIRMED
Severity: minor
Priority: Normal
Component: ethdev
Assignee: [email protected]
Reporter: [email protected]Target Milestone: ---
There is no entry in the PMD feature matrix for bonding device.
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http://bugs.dpdk.org/show_bug.cgi?id=1699
Stephen Hemminger ([email protected]) changed:
What |Removed |Added
----------------------------------------------------------------------------
Resolution|--- |INVALID
Status|UNCONFIRMED |RESOLVED--- Comment #1 from Stephen Hemminger ([email protected]) --- This NIC was dropped from table intentionally by:
commit 7b103c4ccd98e3f3d457c74960acd28dac64392d
Author: Thomas Monjalon <[email protected]> Date: Thu Mar 12 00:01:35 2020 +0100
doc: remove empty columns from NIC features matrix
The virtual PMDs bonding, KNI, null, ring, softnic and vdev_netvsc have no real feature to advertise so they can be removed from the (too) big matrix of ethdev features.
Signed-off-by Thomas Monjalon <[email protected]>
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