dt-bindings:iio: Another set of yaml conversions.
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- v2 Latest29 patches 10 repliesIn review
- v129 patches 32 repliesSuperseded
Changes in v2 from the cover letter
* Updated various maintainers to reflect email bounces.
* dht11 - added note on aosong as probably manufacturer
* hoperf,hp03 - fixed description
* ti,dac082s085
- Family typo
- Put back the reference regulator in example.
- Added checking of XOR of spi-cpha and spi-cpol
* adi,ad7303 - drop adi,use-external-reference from example as no such thing.
Patches in v2 No applies recorded yet
| # | Subject and files | Size | Replies | Applied |
|---|---|---|---|---|
| 1/29 | dt-bindings:iio:humidity:hdc100x Drop separate doc + add to trivial-devicesDocumentation/ Documentation/ | +10 | 0 replies | |
| 2/29 | dt-bindings:iio:humidity:htu21 Drop separate doc + add to trivial-devicesDocumentation/ Documentation/ | +4 | 0 replies | |
| 3/29 | dt-bindings:iio:humidity:st,hts221 yaml conversion.Documentation/ Documentation/ | +52 | 0 replies | |
| 4/29 | dt-bindings:iio:humidity:dht11 yaml conversionDocumentation/ Documentation/ | +41 | 0 replies | |
| 5/29 | dt-bindings:iio:pressure:ms5637 Drop separate doc + add to trivial-devicesDocumentation/ Documentation/ | +8 | 0 replies | |
| 6/29 | dt-bindings:iio:pressure:murata,zpa2326 yaml conversionDocumentation/ Documentation/ | +62 | 0 replies | |
| 7/29 | dt-bindings:iio:pressure:meas,ms5611 yaml conversion.Documentation/ Documentation/ | +57 | 0 replies | |
| 8/29 | dt-bindings:iio:pressure:hoperf,hp03 yaml conversionDocumentation/ Documentation/ | +47 | 0 replies | |
| 9/29 | dt-bindings:iio:proximity:semtech,sx9500 yaml conversion.Documentation/ Documentation/ | +50 | 0 replies | |
| 10/29 | dt-bindings:iio:proximity:st,vl53l0x yaml conversionDocumentation/ Documentation/ | +42 | 0 replies | |
| 11/29 | dt-bindings:iio:proximity:ams,as3935 yaml conversionDocumentation/ Documentation/ | +71 | 0 replies | |
| 12/29 | dt-bindings:iio:dac:ti,dac5571 yaml conversion.Documentation/ Documentation/ | +52 | 0 replies | |
| 13/29 | dt-bindings:iio:dac:ti,dac7311 yaml conversionDocumentation/ Documentation/ | +49 | 0 replies | |
| 14/29 | dt-bindings:iio:dac:ti,dac7512 yaml conversionDocumentation/ Documentation/ | +42 | 0 replies | |
| 15/29 | dt-bindings:iio:dac:ti,dac7612 yaml conversionDocumentation/ Documentation/ | +53 | 0 replies | |
| 16/29 | dt-bindings:iio:dac:ti,dac082s085 yaml conversionDocumentation/ Documentation/ | +79 | 6 replies | |
| 17/29 | dt-bindings:iio:dac:adi,ad7303 yaml conversionDocumentation/ Documentation/ | +50 | 0 replies | |
| 18/29 | dt-bindings:iio:dac:maxim,ds4424 yaml conversionDocumentation/ Documentation/ | +45 | 0 replies | |
| 19/29 | dt-bindings:iio:dac:fsl,vf610-dac yaml conversionDocumentation/ Documentation/ | +55 | 0 replies | |
| 20/29 | dt-bindings:iio:dac:microchip,mcp4725 yaml conversionDocumentation/ Documentation/ | +71 | 0 replies | |
| 21/29 | dt-bindings:iio:dac:maxim,max5821 yaml conversionDocumentation/ Documentation/ | +44 | 0 replies | |
| 22/29 | dt-bindings:iio:dac:nxp,lpc1850-dac yaml conversion.Documentation/ Documentation/ | +58 | 0 replies | |
| 23/29 | dt-bindings:iio:dac:adi,ad5758 yaml conversionDocumentation/ Documentation/ | +129 | 0 replies | |
| 24/29 | dt-bindings:iio:temperature:melexis,mlx90614 yaml conversionDocumentation/ Documentation/ | +50 | 2 replies | |
| 25/29 | dt-bindings:iio:temperature:melexis,mlx90632 conversion to yamlDocumentation/ Documentation/ | +55 | 0 replies | |
| 26/29 | dt-bindings:iio:temperature:meas,tsys01 move to trivial-devices.yamlDocumentation/ Documentation/ | +2 | 1 reply | |
| 27/29 | dt-bindings:iio:temperature:maxim,max31856 yaml conversion.Documentation/ Documentation/ | +54 | 0 replies | |
| 28/29 | dt-bindings:iio:temperature:maxim_thermocouple.txt to maxim,max31855k.yamlDocumentation/ Documentation/ | +76 | 0 replies | |
| 29/29 | dt-bindings:iio:temperature:ti,tmp07 yaml conversionDocumentation/ Documentation/ | +57 | 0 replies |
Reviews trailers per patch
28 of 29 patches have a Reviewed-by or Acked-by.
| Patch | Rob Herring | Matt Ranostay | Harald Geyer | Sean Nyekjaer | Ricardo Ribalda Delgado | Vladimir Zapolskiy | Crt Mori | Manivannan Sadhasivam |
|---|---|---|---|---|---|---|---|---|
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| 29/29 | R-b | A-b |
Trailers given in replies are filled; those carried in the patches from earlier versions are outlined with dashes. Scroll the table sideways for all 8 reviewers.
Cover letter [PATCH v2 00/29] dt-bindings:iio: Another set of yaml conversions.
From: Jonathan Cameron <[email protected]>
This set mostly consists of low hanging fruit along the way to converting all the existing IIO bindings.
@Rob, I've dropped your Reviewed-by for patch 16 because of the major change introducing checking on spi-cpol XOR spi-cpha.
It works, but I'm not sure there isn't a more minimal way of doing it.
I could just have picked up the majority of these, but I forgot to cc the dt mailing list last time so want to resend them anyway.
Changes since v1:
* Updated various maintainers to reflect email bounces.
* dht11 - added note on aosong as probably manufacturer
* hoperf,hp03 - fixed description
* ti,dac082s085
- Family typo
- Put back the reference regulator in example.
- Added checking of XOR of spi-cpha and spi-cpol
* adi,ad7303 - drop adi,use-external-reference from example as no such thing.
Jonathan Cameron (29):
dt-bindings:iio:humidity:hdc100x Drop separate doc + add to
trivial-devices
dt-bindings:iio:humidity:htu21 Drop separate doc + add to
trivial-devices
dt-bindings:iio:humidity:st,hts221 yaml conversion. dt-bindings:iio:humidity:dht11 yaml conversion dt-bindings:iio:pressure:ms5637 Drop separate doc + add to
trivial-devices
dt-bindings:iio:pressure:murata,zpa2326 yaml conversion dt-bindings:iio:pressure:meas,ms5611 yaml conversion. dt-bindings:iio:pressure:hoperf,hp03 yaml conversion dt-bindings:iio:proximity:semtech,sx9500 yaml conversion. dt-bindings:iio:proximity:st,vl53l0x yaml conversion dt-bindings:iio:proximity:ams,as3935 yaml conversion dt-bindings:iio:dac:ti,dac5571 yaml conversion. dt-bindings:iio:dac:ti,dac7311 yaml conversion dt-bindings:iio:dac:ti,dac7512 yaml conversion dt-bindings:iio:dac:ti,dac7612 yaml conversion dt-bindings:iio:dac:ti,dac082s085 yaml conversion dt-bindings:iio:dac:adi,ad7303 yaml conversion dt-bindings:iio:dac:maxim,ds4424 yaml conversion dt-bindings:iio:dac:fsl,vf610-dac yaml conversion dt-bindings:iio:dac:microchip,mcp4725 yaml conversion dt-bindings:iio:dac:maxim,max5821 yaml conversion dt-bindings:iio:dac:nxp,lpc1850-dac yaml conversion. dt-bindings:iio:dac:adi,ad5758 yaml conversion dt-bindings:iio:temperature:melexis,mlx90614 yaml conversion dt-bindings:iio:temperature:melexis,mlx90632 conversion to yaml dt-bindings:iio:temperature:meas,tsys01 move to trivial-devices.yaml dt-bindings:iio:temperature:maxim,max31856 yaml conversion. dt-bindings:iio:temperature:maxim_thermocouple.txt to
maxim,max31855k.yaml
dt-bindings:iio:temperature:ti,tmp07 yaml conversion
.../devicetree/bindings/iio/dac/ad5758.txt | 83 ----------- .../devicetree/bindings/iio/dac/ad7303.txt | 23 ---- .../bindings/iio/dac/adi,ad5758.yaml | 129 ++++++++++++++++++ .../bindings/iio/dac/adi,ad7303.yaml | 50 +++++++ .../devicetree/bindings/iio/dac/ds4424.txt | 20 --- .../bindings/iio/dac/fsl,vf610-dac.yaml | 55 ++++++++ .../bindings/iio/dac/lpc1850-dac.txt | 19 --- .../devicetree/bindings/iio/dac/max5821.txt | 14 -- .../bindings/iio/dac/maxim,ds4424.yaml | 45 ++++++ .../bindings/iio/dac/maxim,max5821.yaml | 44 ++++++ .../devicetree/bindings/iio/dac/mcp4725.txt | 35 ----- .../bindings/iio/dac/microchip,mcp4725.yaml | 71 ++++++++++ .../bindings/iio/dac/nxp,lpc1850-dac.yaml | 58 ++++++++ .../bindings/iio/dac/ti,dac082s085.yaml | 79 +++++++++++ .../bindings/iio/dac/ti,dac5571.txt | 24 ---- .../bindings/iio/dac/ti,dac5571.yaml | 52 +++++++ .../bindings/iio/dac/ti,dac7311.txt | 23 ---- .../bindings/iio/dac/ti,dac7311.yaml | 49 +++++++ .../bindings/iio/dac/ti,dac7512.txt | 20 --- .../bindings/iio/dac/ti,dac7512.yaml | 42 ++++++ .../bindings/iio/dac/ti,dac7612.txt | 28 ---- .../bindings/iio/dac/ti,dac7612.yaml | 53 +++++++ .../bindings/iio/dac/ti-dac082s085.txt | 34 ----- .../devicetree/bindings/iio/dac/vf610-dac.txt | 20 --- .../bindings/iio/humidity/dht11.txt | 14 -- .../bindings/iio/humidity/dht11.yaml | 41 ++++++ .../bindings/iio/humidity/hdc100x.txt | 17 --- .../bindings/iio/humidity/hts221.txt | 30 ---- .../bindings/iio/humidity/htu21.txt | 13 -- .../bindings/iio/humidity/st,hts221.yaml | 52 +++++++ .../bindings/iio/pressure/hoperf,hp03.yaml | 47 +++++++ .../devicetree/bindings/iio/pressure/hp03.txt | 17 --- .../bindings/iio/pressure/meas,ms5611.yaml | 57 ++++++++ .../bindings/iio/pressure/ms5611.txt | 19 --- .../bindings/iio/pressure/ms5637.txt | 17 --- .../bindings/iio/pressure/murata,zpa2326.yaml | 62 +++++++++ .../bindings/iio/pressure/zpa2326.txt | 29 ---- .../bindings/iio/proximity/ams,as3935.yaml | 71 ++++++++++ .../bindings/iio/proximity/as3935.txt | 34 ----- .../iio/proximity/semtech,sx9500.yaml | 50 +++++++ .../bindings/iio/proximity/st,vl53l0x.yaml | 42 ++++++ .../bindings/iio/proximity/sx9500.txt | 23 ---- .../bindings/iio/proximity/vl53l0x.txt | 18 --- .../bindings/iio/temperature/max31856.txt | 24 ---- .../iio/temperature/maxim,max31855k.yaml | 76 +++++++++++ .../iio/temperature/maxim,max31856.yaml | 54 ++++++++ .../iio/temperature/maxim_thermocouple.txt | 24 ---- .../iio/temperature/melexis,mlx90614.yaml | 50 +++++++ .../iio/temperature/melexis,mlx90632.yaml | 55 ++++++++ .../bindings/iio/temperature/mlx90614.txt | 24 ---- .../bindings/iio/temperature/mlx90632.txt | 28 ---- .../bindings/iio/temperature/ti,tmp007.yaml | 57 ++++++++ .../bindings/iio/temperature/tmp007.txt | 33 ----- .../bindings/iio/temperature/tsys01.txt | 19 --- .../devicetree/bindings/trivial-devices.yaml | 24 ++++ 55 files changed, 1465 insertions(+), 726 deletions(-) delete mode 100644 Documentation/devicetree/bindings/iio/dac/ad5758.txt delete mode 100644 Documentation/devicetree/bindings/iio/dac/ad7303.txt create mode 100644 Documentation/devicetree/bindings/iio/dac/adi,ad5758.yaml create mode 100644 Documentation/devicetree/bindings/iio/dac/adi,ad7303.yaml delete mode 100644 Documentation/devicetree/bindings/iio/dac/ds4424.txt create mode 100644 Documentation/devicetree/bindings/iio/dac/fsl,vf610-dac.yaml delete mode 100644 Documentation/devicetree/bindings/iio/dac/lpc1850-dac.txt delete mode 100644 Documentation/devicetree/bindings/iio/dac/max5821.txt create mode 100644 Documentation/devicetree/bindings/iio/dac/maxim,ds4424.yaml create mode 100644 Documentation/devicetree/bindings/iio/dac/maxim,max5821.yaml delete mode 100644 Documentation/devicetree/bindings/iio/dac/mcp4725.txt create mode 100644 Documentation/devicetree/bindings/iio/dac/microchip,mcp4725.yaml create mode 100644 Documentation/devicetree/bindings/iio/dac/nxp,lpc1850-dac.yaml create mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac082s085.yaml delete mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac5571.txt create mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac5571.yaml delete mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac7311.txt create mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac7311.yaml delete mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac7512.txt create mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac7512.yaml delete mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac7612.txt create mode 100644 Documentation/devicetree/bindings/iio/dac/ti,dac7612.yaml delete mode 100644 Documentation/devicetree/bindings/iio/dac/ti-dac082s085.txt delete mode 100644 Documentation/devicetree/bindings/iio/dac/vf610-dac.txt delete mode 100644 Documentation/devicetree/bindings/iio/humidity/dht11.txt create mode 100644 Documentation/devicetree/bindings/iio/humidity/dht11.yaml delete mode 100644 Documentation/devicetree/bindings/iio/humidity/hdc100x.txt delete mode 100644 Documentation/devicetree/bindings/iio/humidity/hts221.txt delete mode 100644 Documentation/devicetree/bindings/iio/humidity/htu21.txt create mode 100644 Documentation/devicetree/bindings/iio/humidity/st,hts221.yaml create mode 100644 Documentation/devicetree/bindings/iio/pressure/hoperf,hp03.yaml delete mode 100644 Documentation/devicetree/bindings/iio/pressure/hp03.txt create mode 100644 Documentation/devicetree/bindings/iio/pressure/meas,ms5611.yaml delete mode 100644 Documentation/devicetree/bindings/iio/pressure/ms5611.txt delete mode 100644 Documentation/devicetree/bindings/iio/pressure/ms5637.txt create mode 100644 Documentation/devicetree/bindings/iio/pressure/murata,zpa2326.yaml delete mode 100644 Documentation/devicetree/bindings/iio/pressure/zpa2326.txt create mode 100644 Documentation/devicetree/bindings/iio/proximity/ams,as3935.yaml delete mode 100644 Documentation/devicetree/bindings/iio/proximity/as3935.txt create mode 100644 Documentation/devicetree/bindings/iio/proximity/semtech,sx9500.yaml create mode 100644 Documentation/devicetree/bindings/iio/proximity/st,vl53l0x.yaml delete mode 100644 Documentation/devicetree/bindings/iio/proximity/sx9500.txt delete mode 100644 Documentation/devicetree/bindings/iio/proximity/vl53l0x.txt delete mode 100644 Documentation/devicetree/bindings/iio/temperature/max31856.txt create mode 100644 Documentation/devicetree/bindings/iio/temperature/maxim,max31855k.yaml create mode 100644 Documentation/devicetree/bindings/iio/temperature/maxim,max31856.yaml delete mode 100644 Documentation/devicetree/bindings/iio/temperature/maxim_thermocouple.txt create mode 100644 Documentation/devicetree/bindings/iio/temperature/melexis,mlx90614.yaml create mode 100644 Documentation/devicetree/bindings/iio/temperature/melexis,mlx90632.yaml delete mode 100644 Documentation/devicetree/bindings/iio/temperature/mlx90614.txt delete mode 100644 Documentation/devicetree/bindings/iio/temperature/mlx90632.txt create mode 100644 Documentation/devicetree/bindings/iio/temperature/ti,tmp007.yaml delete mode 100644 Documentation/devicetree/bindings/iio/temperature/tmp007.txt delete mode 100644 Documentation/devicetree/bindings/iio/temperature/tsys01.txt
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