Re-introduce TX FIFO resize for larger EP bursting
Subsystems (5)
v2 cover Re-introduce TX FIFO resize for larger EP bursting
Changes in V2:
- Modified TXFIFO resizing logic to ensure that each EP is reserved a FIFO.
- Removed dev_dbg() prints and fixed typos from patches
- Added some more description on the dt-bindings commit message
Currently, there is no functionality to allow for resizing the TXFIFOs, and relying on the HW default setting for the TXFIFO depth. In most cases, the HW default is probably sufficient, but for USB compositions that contain multiple functions that require EP bursting, the default settings might not be enough. Also to note, the current SW will assign an EP to a function driver w/o checking to see if the TXFIFO size for that particular EP is large enough. (this is a problem if there are multiple HW defined values for the TXFIFO size)
It is mentioned in the SNPS databook that a minimum of TX FIFO depth = 3 is required for an EP that supports bursting. Otherwise, there may be frequent occurences of bursts ending. For high bandwidth functions, such as data tethering (protocols that support data aggregation), mass storage, and media transfer protocol (over FFS), the bMaxBurst value can be large, and a bigger TXFIFO depth may prove to be beneficial in terms of USB throughput. (which can be associated to system access latency, etc...) It allows for a more consistent burst of traffic, w/o any interruptions, as data is readily available in the FIFO.
With testing done using the mass storage function driver, the results show that with a larger TXFIFO depth, the bandwidth increased significantly.
Test Parameters:
- Platform: Qualcomm SM8150
- bMaxBurst = 6
- USB req size = 256kB
- Num of USB reqs = 16
- USB Speed = Super-Speed
- Function Driver: Mass Storage (w/ ramdisk)
- Test Application: CrystalDiskMark
Results:
TXFIFO Depth = 3 max packets
Test Case | Data Size | AVG tput (in MB/s)
-------------------------------------------
Sequential|1 GB x |
Read |9 loops | 193.60
| | 195.86
| | 184.77
| | 193.60-------------------------------------------
TXFIFO Depth = 6 max packets
Test Case | Data Size | AVG tput (in MB/s)
-------------------------------------------
Sequential|1 GB x |
Read |9 loops | 287.35
| | 304.94
| | 289.64
| | 293.61-------------------------------------------
Wesley Cheng (3):
usb: dwc3: Resize TX FIFOs to meet EP bursting requirements
arm64: boot: dts: qcom: sm8150: Enable dynamic TX FIFO resize logic
dt-bindings: usb: dwc3: Add entry for tx-fifo-resize
Documentation/devicetree/bindings/usb/dwc3.txt | 2 +- arch/arm64/boot/dts/qcom/sm8150.dtsi | 1 + drivers/usb/dwc3/core.c | 2 + drivers/usb/dwc3/core.h | 8 ++ drivers/usb/dwc3/ep0.c | 37 ++++++++- drivers/usb/dwc3/gadget.c | 111 +++++++++++++++++++++++++ 6 files changed, 159 insertions(+), 2 deletions(-)
Signature · 2 lines
The Qualcomm Innovation Center, Inc. is a member of the Code Aurora Forum, a Linux Foundation Collaborative Project
PATCH v2 1/3 usb: dwc3: Resize TX FIFOs to meet EP bursting requirements
Some devices have USB compositions which may require multiple endpoints that support EP bursting. HW defined TX FIFO sizes may not always be sufficient for these compositions. By utilizing flexible TX FIFO allocation, this allows for endpoints to request the required FIFO depth to achieve higher bandwidth. With some higher bMaxBurst configurations, using a larger TX FIFO size results in better TX throughput.
Ensure that one TX FIFO is reserved for every IN endpoint. This allows for the FIFO logic to prevent running out of FIFO space.
--- drivers/usb/dwc3/core.c | 2 + drivers/usb/dwc3/core.h | 8 ++++ drivers/usb/dwc3/ep0.c | 37 +++++++++++++++- drivers/usb/dwc3/gadget.c | 111 ++++++++++++++++++++++++++++++++++++++++++++++ 4 files changed, 157 insertions(+), 1 deletion(-)
drivers/usb/dwc3/core.c +2 -0
@@ -1304,6 +1304,8 @@ static void dwc3_get_properties(struct dwc3 *dwc) &tx_thr_num_pkt_prd);device_property_read_u8 (dev,"snps,tx-max-burst-prd" , &tx_max_burst_prd); + dwc->needs_fifo_resize =device_property_read_bool (dev, +"tx-fifo-resize" ); dwc->disable_scramble_quirk =device_property_read_bool (dev,"snps,disable_scramble_quirk" );
drivers/usb/dwc3/core.h +8 -0
@@ -675,6 +675,7 @@ struct dwc3_event_buffer {* isochronous START TRANSFER command failure workaround * @start_cmd_status: the status of testing START TRANSFER command with * combo_num = 'b00 +* @fifo_depth: allocated TXFIFO depth */ struct dwc3_ep {struct usb_ep endpoint;
@@ -727,6 +728,7 @@ struct dwc3_ep {/* For isochronous START TRANSFER workaround only */ u8 combo_num;int start_cmd_status; +int fifo_depth; };enum dwc3_phy {
@@ -1004,6 +1006,7 @@ struct dwc3_scratchpad_array {* 1 - utmi_l1_suspend_n * @is_fpga: true when we are using the FPGA board * @pending_events: true when we have pending IRQs to be handled +* @needs_fifo_resize: not all users might want fifo resizing, flag it * @pullups_connected: true when Run/Stop bit is set * @setup_packet_pending: true when there's a Setup Packet in FIFO. Workaround * @three_stage_setup: set if we perform a three phase setup
@@ -1044,6 +1047,8 @@ struct dwc3_scratchpad_array {* @dis_metastability_quirk: set to disable metastability quirk. * @imod_interval: set the interrupt moderation interval in 250ns * increments or 0 to disable. +* @last_fifo_depth: total TXFIFO depth of all enabled USB IN/INT endpoints +* @num_ep_resized: the number of TX FIFOs that have already been resized */ struct dwc3 {struct work_struct drd_work;
@@ -1204,6 +1209,7 @@ struct dwc3 { unsigned is_utmi_l1_suspend:1; unsigned is_fpga:1; unsigned pending_events:1; + unsigned needs_fifo_resize:1; unsigned pullups_connected:1; unsigned setup_packet_pending:1; unsigned three_stage_setup:1;
@@ -1236,6 +1242,8 @@ struct dwc3 { unsigned dis_metastability_quirk:1;u16 imod_interval; +int last_fifo_depth; +int num_ep_resized; };#define INCRX_BURST_MODE 0
drivers/usb/dwc3/ep0.c +36 -1
@@ -601,8 +601,9 @@ static int dwc3_ep0_set_config(struct dwc3 *dwc, struct usb_ctrlrequest *ctrl) {enum usb_device_state state = dwc->gadget.state;u32 cfg; -int ret; +int ret, num, size;u32 reg; +struct dwc3_ep *dep; cfg =le16_to_cpu (ctrl->wValue);
@@ -611,6 +612,40 @@ static int dwc3_ep0_set_config(struct dwc3 *dwc, struct usb_ctrlrequest *ctrl)return -EINVAL ;case USB_STATE_ADDRESS : +/* +* If tx-fifo-resize flag is not set for the controller, then +* do not clear existing allocated TXFIFO since we do not +* allocate it again in dwc3_gadget_resize_tx_fifos +*/ +if (dwc->needs_fifo_resize) { +/* Read ep0IN related TXFIFO size */ + dep = dwc->eps[1 ]; + size =dwc3_readl (dwc->regs,DWC3_GTXFIFOSIZ (0 )); +if (dwc3_is_usb31 (dwc)) + dep->fifo_depth =DWC31_GTXFIFOSIZ_TXFDEP (size); +else + dep->fifo_depth =DWC3_GTXFIFOSIZ_TXFDEP (size); + + dwc->last_fifo_depth = dep->fifo_depth; +/* Clear existing TXFIFO for all IN eps except ep0 */ +for (num =3 ; num <min_t (int, dwc->num_eps, +DWC3_ENDPOINTS_NUM ); num +=2 ) { + dep = dwc->eps[num]; +/* Don't change TXFRAMNUM on usb31 version */ + size =dwc3_is_usb31 (dwc) ? +dwc3_readl (dwc->regs, +DWC3_GTXFIFOSIZ (num >>1 )) & +DWC31_GTXFIFOSIZ_TXFRAMNUM : +0 ; + +dwc3_writel (dwc->regs, +DWC3_GTXFIFOSIZ (num >>1 ), + size); + dep->fifo_depth =0 ; + } + dwc->num_ep_resized =0 ; + } + ret =dwc3_ep0_delegate_req (dwc, ctrl);/* if the cfg matches and the cfg is non zero */ if (cfg && (!ret || (ret ==USB_GADGET_DELAYED_STATUS ))) {
drivers/usb/dwc3/gadget.c +111 -0
123 lines not on this page · raw message
Signature · 2 lines
The Qualcomm Innovation Center, Inc. is a member of the Code Aurora Forum, a Linux Foundation Collaborative Project
PATCH v2 2/3 arm64: boot: dts: qcom: sm8150: Enable dynamic TX FIFO resize logic
In reply to Wesley ChengEnable the flexible TX FIFO resize logic on SM8150. Using a larger TX FIFO SZ can help account for situations when system latency is greater than the USB bus transmission latency.
--- arch/arm64/boot/dts/qcom/sm8150.dtsi | 1 + 1 file changed, 1 insertion(+)
arch/arm64/boot/dts/qcom/sm8150.dtsi +1 -0
@@ -708,6 +708,7 @@ interrupts = <GIC_SPI 133 IRQ_TYPE_LEVEL_HIGH>; snps,dis_u2_susphy_quirk; snps,dis_enblslpm_quirk; + tx-fifo-resize; phys = <&usb_1_hsphy>, <&usb_1_ssphy>; phy-names = "usb2-phy", "usb3-phy"; };
Signature · 2 lines
The Qualcomm Innovation Center, Inc. is a member of the Code Aurora Forum, a Linux Foundation Collaborative Project
PATCH v2 3/3 dt-bindings: usb: dwc3: Add entry for tx-fifo-resize
In reply to Wesley ChengRe-introduce the comment for the tx-fifo-resize setting for the DWC3 controller. This allows for vendors to control if they require the TX FIFO resizing logic on their HW, as the default FIFO size configurations may already be sufficient.
--- Documentation/devicetree/bindings/usb/dwc3.txt | 2 +- 1 file changed, 1 insertion(+), 1 deletion(-)
Documentation/devicetree/bindings/usb/dwc3.txt +1 -1
@@ -105,7 +105,7 @@ Optional properties: 1-16 (DWC_usb31 programming guide section 1.2.3) to enable periodic ESS TX threshold. - - <DEPRECATED> tx-fifo-resize: determines if the FIFO *has* to be reallocated. + - tx-fifo-resize: determines if the FIFO *has* to be reallocated. - snps,incr-burst-type-adjustment: Value for INCR burst type of GSBUSCFG0 register, undefined length INCR burst type enable and INCRx type. When just one value, which means INCRX burst mode enabled. When
Signature · 2 lines
The Qualcomm Innovation Center, Inc. is a member of the Code Aurora Forum, a Linux Foundation Collaborative Project
Quoted 11 lines · Wesley Cheng
Changes in V2:
- Modified TXFIFO resizing logic to ensure that each EP is reserved a FIFO.
- Removeddev_dbg()prints and fixed typos from patches
- Added some more description on the dt-bindings commit messageReviewed-by Felipe Balbi <[email protected]>Reviewed-by Rob Herring <[email protected]>
Sorry, please disregard the Reviewed-by tags in the patches. I added those mistakenly.
Quoted 68 lines
Currently, there is no functionality to allow for resizing the TXFIFOs, and relying on the HW default setting for the TXFIFO depth. In most cases, the HW default is probably sufficient, but for USB compositions that contain multiple functions that require EP bursting, the default settings might not be enough. Also to note, the current SW will assign an EP to a function driver w/o checking to see if the TXFIFO size for that particular EP is large enough. (this is a problem if there are multiple HW defined values for the TXFIFO size)
It is mentioned in the SNPS databook that a minimum of TX FIFO depth = 3 is required for an EP that supports bursting. Otherwise, there may be frequent occurences of bursts ending. For high bandwidth functions, such as data tethering (protocols that support data aggregation), mass storage, and media transfer protocol (over FFS), the bMaxBurst value can be large, and a bigger TXFIFO depth may prove to be beneficial in terms of USB throughput. (which can be associated to system access latency, etc...) It allows for a more consistent burst of traffic, w/o any interruptions, as data is readily available in the FIFO.
With testing done using the mass storage function driver, the results show that with a larger TXFIFO depth, the bandwidth increased significantly.
Test Parameters:
- Platform: Qualcomm SM8150
- bMaxBurst = 6
- USB req size = 256kB
- Num of USB reqs = 16
- USB Speed = Super-Speed
- Function Driver: Mass Storage (w/ ramdisk)
- Test Application: CrystalDiskMarkResults:
TXFIFO Depth = 3 max packets
Test Case | Data Size | AVG tput (in MB/s)
-------------------------------------------Sequential|1 GB x | Read |9 loops | 193.60 | | 195.86 | | 184.77 | | 193.60-------------------------------------------
TXFIFO Depth = 6 max packets
Test Case | Data Size | AVG tput (in MB/s)
-------------------------------------------Sequential|1 GB x | Read |9 loops | 287.35 | | 304.94 | | 289.64 | | 293.61-------------------------------------------
Wesley Cheng (3):
usb: dwc3: Resize TX FIFOs to meet EP bursting requirements
arm64: boot: dts: qcom: sm8150: Enable dynamic TX FIFO resize logic
dt-bindings: usb: dwc3: Add entry for tx-fifo-resizeDocumentation/devicetree/bindings/usb/dwc3.txt | 2 +- arch/arm64/boot/dts/qcom/sm8150.dtsi | 1 + drivers/usb/dwc3/core.c | 2 + drivers/usb/dwc3/core.h | 8 ++ drivers/usb/dwc3/ep0.c | 37 ++++++++- drivers/usb/dwc3/gadget.c | 111 +++++++++++++++++++++++++ 6 files changed, 159 insertions(+), 2 deletions(-)
Signature · 2 lines
The Qualcomm Innovation Center, Inc. is a member of the Code Aurora Forum, a Linux Foundation Collaborative Project
Quoted 7 lines · Wesley Cheng
Changes in V2:
- Modified TXFIFO resizing logic to ensure that each EP is reserved a FIFO.
- Removeddev_dbg()prints and fixed typos from patches
- Added some more description on the dt-bindings commit messageReviewed-by Felipe Balbi <[email protected]>
I don't remember giving you a Reviewed-by, did I?
Signature · 1 line
balbi
Quoted 8 lines · Felipe Balbi
Quoted 6 lines · Wesley Cheng
Changes in V2:
- Modified TXFIFO resizing logic to ensure that each EP is reserved a FIFO.
- Removeddev_dbg()prints and fixed typos from patches
- Added some more description on the dt-bindings commit message
Quoted 4 lines
Quoted 1 line
Reviewed-by Felipe Balbi <[email protected]>I don't remember giving you a Reviewed-by, did I?
Hi Felipe,
Sorry, I put the Reviewed-by tag by mistake, I sent a follow up email to disregard the tags. If you need me to resubmit the patch series version, please let me know. Thanks!
Signature · 2 lines
The Qualcomm Innovation Center, Inc. is a member of the Code Aurora Forum, a Linux Foundation Collaborative Project